-- Reinforced substrate using spunbound materials and technology
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The U.S. Army Natick Contracting Division plans to negotiate and award a sole source firm fixed price research and development contract to Hills, Inc. for the development of alternative reinforced substrate materials using spunbound technologies. This effort aims to produce R&D samples that outperform the current paper substrate in durability and lifespan while meeting or exceeding all existing performance requirements. Hills, Inc. is uniquely qualified to provide this development due to its patented nonwoven component technology and expertise in layered polymer combinations, processing conditions, and fiber cross-sections, which are integral to creating advanced spunbound and meltdown web structures. All deliverables will be shipped FOB destination to the U.S. Army Soldier Systems Center in Natick, MA. The acquisition is conducted under FAR 6.302-1 authority and no solicitation document has been issued, as this notice serves as the sole official announcement. Interested parties can contact the assigned Contract Specialist via email for more information. The announcement closes on March 11, 2005, at 2 PM Eastern Standard Time.
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