RELAY, ELECTROMAGNETIC

RELAY,ELECTROMAGNETIC
RELAY,ELECTROMAGNETIC
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment
RD002, COVERED DEFENSE INFORMATION APPLIES
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS (IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
THE USE OF ANY CLASS I OZONE-DEPLETING SUBSTANCE
(ODS) IN THE DESIGN, MANUFACTURING, TESTING,
CLEANING, OR ANY OTHER PROCESS FOR THIS ITEM
UNDER ANY MILITARY OR FEDERAL SPECIFICATION,
STANDARD OR DRAWING REFERENCED IN THIS ITEM
DESCRIPTION IS "PROHIBITED" UNLESS THE SEPARATE
WRITTEN APPROVAL OF THE CONTRACTING OFFICER IS
OBTAINED. THIS PROHIBITION SUPERSEDES ALL
SPECIFICATION REQUIREMENTS BUT DOES NOT
ALLEVIATE ANY PRODUCT PERFORMANCE REQUIREMENTS.
THIS DOES NOT APPLY TO COMMERCIAL ITEMS, AS
DEFINED IN "FAR 11.001" OR TO PART-NUMBERED
ONLY ITEMS.
FULL AND OPEN COMPETITION APPLIES.
THIS NSN IS LISTED AS A PRIMARY QPL OR QML THEREFORE
THE QUALIFIED PRODUCTS LIST OR QUALIFIED MANUFACTURERS
LIST IS APPLICABLE.
CRITICAL APPLICATION ITEM
TDP Rev A Gen 1 IAW BASIC SPEC NR MIL-PRF-6106R(1) SUP 1A REVISION NR R DTD 07/11/2025 PART PIECE NUMBER: M6106/12-001
TDP Rev A Gen 1 IAW REFERENCE SPEC NR MIL-PRF-6106/12G REVISION NR G DTD 07/27/2020 PART PIECE NUMBER: M6106/12-001
SPE7M5-26-T-417Q
SECTION B
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017919162 0001 EA 60.000
NSN/MATERIAL:5945013322618
DELIVERY (IN DAYS):0020
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:10 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:JA CUSH/DUNN MAT:00 CUSH/DUNN THKNESS:0
UNIT CONT:A1 OPI:M
INTRMDTE CONT:D3 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association
SPE7M5-26-T-417Q
SECTION B
PR: 7017919162 PRLI: 0001 CONT’D
Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
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Need Ship Date:00/00/0000 Original Required Delivery Date:08/13/2026
SPE7M5-26-T-417Q NSN/Part Number: 5945-01-332-2618 Quantity: 60 EA Purchase Request: 7017919162QTY: 60 Delivery: 20 days ADO