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This Solicitation opportunity from Department Of Defense was posted on July 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

SEMICONDUCTOR DEVIC

Closed
SPE7M1-26-Q-1242Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413
New
DIBBS
MICROCIRCUIT, LINEAR
Solicitation # SPE7M5-27-T-1071
Solicitation SPE7M5-27-T-1071 is a total small business set-aside issued by the DLA Weapons Support Active Devices Division for the procurement of 19 linear microcircuits, identified as NSN 5962-01-394-2132. This is a critical application item that must be sourced from the Qualified Manufacturers List (QML) and adhere to TDP Rev B Gen 2, Basic Drawing NR 67268 81006, Revision NR L. The contract is a fixed-price acquisition with a need ship date of November 12, 2026, and an original required delivery date of May 28, 2027. Delivery is FOB Origin, with inspection and acceptance occurring at the destination in Columbus, Ohio. The contractor must adhere to stringent quality and security requirements, including a CMMC Level 2 Self-Assessment and strict supply chain traceability. Documentation, specifically DLA Land and Maritime Form 918 and unredacted traceability or test reports, must be submitted via email for approval at least 15 days prior to the delivery date; shipment is prohibited without written authorization from the contract administrator. Packaging must meet MIL-STD-2073-1E and MIL-PRF-81705 standards for ESD and EMI protection, while marking must comply with MIL-STD-129 and IPC/JEDEC J-STD-609 to identify lead and lead-free attributes. Payment will be processed electronically through the Wide Area WorkFlow system.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

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about 16 hours ago

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NAICS: 334413
New
DIBBS
MICROCIRCUIT, DIGITA
Solicitation # SPE7M5-27-T-1056
Solicitation SPE7M5-27-T-1056 is a fixed-price procurement by the DLA Weapons Support Active Devices Division for 12 units of a digital microcircuit, identified as NSN 5962012658198. This is designated as a critical application item and must be manufactured according to Drawing 5962-87802 Revision E. The acquisition is restricted to approved sources of supply, and the government will not evaluate offers involving additive manufacturing. The need ship date is October 6, 2026, with an original required delivery date of January 31, 2027, and delivery is set as FOB Origin to DLA Distribution DDWO in Columbus, Ohio. The contract mandates rigorous quality and packaging standards, including DoD qualified ESD and EMI protective materials per MIL-PRF-81705 and specific cushioning requirements under A-A-59136 to prevent lead damage. Contractors must provide comprehensive supply chain traceability documentation and a completed DLA Land and Maritime Form 918 at least 15 days prior to delivery; shipment is prohibited until written authorization is received from the contract administrator. Additionally, the item must comply with IPC/JEDEC J-STD-609 for lead finish marking and MIL-STD-129 for general marking. Compliance with CMMC Level 2 self-assessment, the Buy American Act, and the prohibition of intentionally added mercury is also required.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 16 hours ago

DEADLINE

in 2 days

AI Contract Overview

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The contract pertains to the procurement of a semiconductor device identified by NSN/Part Number 5961-01-353-9189, with a quantity of two units requested under Purchase Request 7016059402. The solicitation is issued by the Defense Logistics Agency under the Department of Defense, with the official solicitation number SPE7M1-26-Q-1242. The solicitation was posted on July 10, 2026, and responses must be submitted by July 25, 2026, indicating a standard sixteen-day window for potential vendors to respond. This is a federal procurement opportunity with no specific set-aside classification noted, and the place of performance and recipient address details are not specified. The contract type is listed as a solicitation, indicating the Department of Defense is seeking competitive offers for the specified semiconductor device, which is likely intended for critical defense or military systems. Further information and submission details can be accessed via the provided DIBBS portal link.

General Info

Procurement of two semiconductor devices under DLA solicitation, responses due July 25, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

0

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Timeline

PhaseClosed
Posted

Solicitation

Response Deadline

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Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeUSA
Office AddressUSA
ContactsNo contact information available

Full Description

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SEMICONDUCTOR DEVIC NSN/Part Number: 5961-01-353-9189 Purchase Request: 7016059402QTY: 2

More opportunities from Department Of Defense → Defense Logistics Agency

Same awarding agency

NAICS: 325520
New
DIBBS
RESIN EPOXY
Solicitation # SPE8ES-27-T-0148
Solicitation SPE8ES-27-T-0148 is a total small business set-aside request for quotations issued by the Defense Logistics Agency Troop Support for the procurement of 72 cases of Resin Epoxy, identified by NSN 8040-01-664-1544. Each case must contain 12 units. The requirement is for delivery FOB Destination to the HAZMINCEN Naval Base Ventura County in Port Hueneme, California, with an original required delivery date of October 23, 2026, and a delivery window of 20 days after the order is placed. The material is classified as a Type I (Code K) item with a non-extendable shelf life of 18 months, calculated from the date of shipment. Due to the hazardous nature of the material, the supplier must provide Safety Data Sheets and Hazardous Communication Standard labels for review and approval prior to the award, adhering to 29 CFR 1910.1200 and Federal Standard No. 313-E. Packaging and marking must comply with MIL-STD-2073-1E, MIL-STD-129, and DLA packaging requirements, with specific storage instructions to maintain a temperature between 60 and 80 degrees Fahrenheit. Administrative requirements include the use of the Wide Area WorkFlow system for electronic invoicing and payment. The contract incorporates several critical federal and defense clauses, including the Buy American and Balance of Payments Program, NIST SP 800-171 assessment requirements, and safeguarding of covered defense information. Inspection and acceptance will occur at the destination point.
Adhesive Manufacturing

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