This Solicitation opportunity from Department Of Defense was posted on August 31, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
SEMICONDUCTOR DEVIC
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
Active Opportunities Like This One
AI Contract Overview
Solicitation SPE7M5-26-Q-0865 is a request for 50 units of a semiconductor device diode, part number JANTX1N4550RB, under NSN 5961-01-187-2071. The procurement is conducted via full and open competition by the Department of Defense Active Devices Division. The item must adhere to technical specifications MIL-PRF-19500/358G(3) and MIL-PRF-19500R(1). Delivery is required within 203 days after order, with the destination and acceptance point set at the DLA Distribution New Cumberland facility in Pennsylvania. The contract mandates strict quality and compliance standards, including the use of Qualified Manufacturers Lists and Qualified Suppliers Lists of Distributors for Federal Supply Class 5961 and 5962. Contractors must maintain supply chain traceability documentation and comply with specific marking and labeling requirements per IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the item requires specialized electrostatic discharge and electromagnetic interference protective packaging in accordance with MIL-PRF-81705 to prevent damage to components.
General Info
Agency
NAICS
Place of Performance
2083 NORMANDY DRIVE DOOR 113 TO 134, NEW CUMBERLAND, PA, 17070-5002, USASet-Aside
Timeline
Submission Closed
Organization & Contact Information
Full Description
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THEWEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER INEFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ONTHE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATECONTROLS.
RQ007: QUALIFIED MANUFACTURERS LIST (QML) INTEGRATED CIRCUITS, HYBRID
MICROCIRCUITS, AND SEMICONDUCTOR DEVICES DLAMARITIME
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS(QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERSFOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017:PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OFSUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The fulltext of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
FULL AND OPEN COMPETITION APPLIES.
TDP Rev AGen 1 IAW BASIC SPEC NR MIL-PRF-19500/358G(3) REVISION NR G DTD 05/29/2026 PART PIECE NUMBER: JANTX1N4550RB
TDP Rev A Gen 1 IAW REFERENCE SPEC NR MIL-PRF-19500R(1) REVISION NR R DTD 02/06/2026 PART PIECE NUMBER: JANTX1N4550RB
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments%2FDLMS% 2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
SPE7M5-26-Q-0865
SECTION B
SUPPLY/SERVICE: 5961-01-187-2071 CONT'D
ITEM NO. SUPPLIES/SERVICES QUANTITY UNIT UNIT PRICE AMOUNT.
0001 5961-01-187-2071 50.000 EA $ _______________ $ _______________
SEMICONDUCTOR
DEVIC
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
FOB: ORIGIN DELIVERY DATE: 203 DAYS ADO
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NB CUSH/DUNNTHKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:100
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITHMIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
ZZ -ADDITIONAL SPECIAL MARKING: 39 ESD SENSITIVE ELECTRONIC DEVICEREQUIREMENTS OF MIL-STD-129 APPLY.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement ofthe markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may bepurchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid StateTechnology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In additionto all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance withparagraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printedcircuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current versionof this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, orthe Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components withpins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protectivepackaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II,Class H, Style 2) barrier
SPE7M5-26-Q-0865
SECTION B
SUPPLY/SERVICE: 5961-01-187-2071 CONT'D
material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protectionMIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall beresponsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturercurrently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packagingwebsite: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitationdoes not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmentalfield forces, Offerors shall provide appropriate technical packaging data with their proposals.
IP027: PACKING AND MARKINGREQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
PARCEL POST ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE C20 AND
CONTRACT
FREIGHT SHIPPING ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
GOVT USE
External External External Customer RDD/ ITEM PR PRLI PR PRLI Material Need Ship Date. 0001 7017528252 0001 N/A N/A N/A 10/14/2026
SPE7M5-26-Q-0865 NSN/Part Number: 5961-01-187-2071 Quantity: 50 EA Purchase Request: 7017528252QTY: 50 Delivery: 203 days ADO
More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION
Same awarding agency
Find Active Opportunities Like This
Get AI-powered intelligence on the opportunities still open
Every page of the solicitation package shredded into a compliance breakdown
AI-powered matching based on your capabilities and past performance
Competitor and incumbent history on the requirement
Automated alerts on amendments, Q&A deadlines, and award
Join 650+ contractors already using CLEATUS
