SEMICONDUCTOR DEVIC

The contract involves the procurement of 15 units of a semiconductor device diode assembly identified by NSN 5961-01-585-5724, with delivery required 634 days after award to the DLA Distribution New Cumberland Facility in Pennsylvania. Technical and quality requirements are governed by the DLA Master List of Technical and Quality Requirements, referenced via R and I identifiers, and include strict compliance with MIL-STD-1916 or comparable zero-based sampling plans that mandate zero non-conformances for acceptance unless otherwise specified. The item is subject to export control under ITAR or EAR, restricting disclosure to foreign persons and requiring DLA contractors to hold JCP certification, complete export control training, and receive prior authorization to access controlled technical data. Packaging must comply with MIL-STD-2073-1E and MIL-PRF-81705 for ESD and EMI protection, using qualified materials listed on QPL-81705, with unit containers specified as Type E5 and preservation method GX under cold, dry conditions. Marking requirements adhere to MIL-STD-129 for shipment and storage, and IPC/JEDEC J-STD-609 for lead finish identification, with special ESD markings applied per code 39-39. Item Unique Identification is not required per DFARS 252.211-7003. The contract mandates compliance with CMMC Level 2 cybersecurity standards, ISO 9001:2015 quality management, and full adherence to hazardous material labeling and Safety Data Sheet submission requirements. The evaluation is conducted on a Lowest Price Technically Acceptable basis, where failure to meet any mandatory technical, quality, or regulatory requirement renders an offer ineligible. Payment is administered electronically through WAWF, and the sole point of contact for procurement inquiries is Kay Bates of the DLA ASC Supplier Operations OEM Division. All proposals must be submitted electronically via DIBBS by the deadline of July 24, 2026, and the FOB Origin pricing structure applies despite FOB Destination delivery terms.