This Subcontract opportunity from Department Of Defense was posted on September 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Semiconductor Device Assembly Supplier

Closed

Federal

Submission Closed09/28/2026, 01:00:00 PM EDT

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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2 days ago

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in 5 days

AI Contract Overview

This subcontract involves the supply of semiconductor device assemblies for prime contractors fulfilling Department of Defense contracts through the Active Devices Division. The selected provider is responsible for manufacturing or sourcing five units of the assembly identified by NSN 5961-01-185-2816 using specialized semiconductor fabrication equipment. All deliverables must strictly adhere to the DLA Master List of Technical and Quality Requirements RA001 and the specific technical specifications associated with the NSN. The performance of this contract is centered in New Cumberland, Pennsylvania, with a response deadline of September 28, 2026.

General Info

Supply five semiconductor device assemblies (NSN 5961-01-185-2816) by September 28, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-504S.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE A

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Timeline

PhaseClosed

PostedSep 16

subcontract

Response DeadlineSep 28

Deadline has passed

Submission Closed

09/28/2026, 01:00:00 PM EDT

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Supplies semiconductor device assemblies for prime contractors delivering DLA supply contracts. Manufactures or sources the assembly identified by NSN 5961-01-185-2816 using semiconductor fabrication equipment. Ensures compliance with the DLA Master List of Technical and Quality Requirements (RA001) and specific NSN technical specifications. Delivers 5 units of the semiconductor device assembly.