SEMICONDUCTOR DEVICE, DIODE

This contract specifies the procurement of a semiconductor diode identified by NSN 5961016681882 and part number MXSMLJ150CAE3, with a quantity of two units requiring delivery within five days FOB origin. The item is subject to stringent quality and packaging controls, including mandatory compliance with DLA Master List technical requirements, qualified supplier listings for Federal Supply Class 5961, and supply chain traceability documentation per DLA Directive Procurement Note C03. All unit packages must be marked according to IPC/JEDEC J-STD-609 to identify lead content, and packaging must adhere to MIL-STD-2073-1E and MIL-STD-129 standards with special ESD marking code 39. ESD and EMI protection is required using qualified barrier materials listed on QPL-81705, with specific packaging types mandated for component safety. Inspection and acceptance occur at destination under a zero-defect sampling plan aligned with MIL-STD-1916 or ASQ H1331, with critical attributes held to an AQL of 0.1. The supplier must ensure all packaging materials are sourced from qualified manufacturers and provide documentation to support compliance. Packaging materials must prevent physical damage to leads and terminals, and the item is explicitly excluded from surplus acceptance. Shipment must be sent via fastest traceable means, not parcel post, to the designated military receiving location at Tinker AFB, Oklahoma, with the required delivery date set for July 21, 2026.