SEMICONDUCTOR DEVICE, D

SEMICONDUCTOR DEVICE,DIODE
DIODE VOLTAGE REGULATOR SELECTED
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-27-T-1876
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
QUOTE/AWARD TO BE IAW 30003 2881122 AND POSSESS
THE DEGREE OF INTERCHANGEABILITY AS DEFINED IN
MIL-STD 280A PARA.3.2.1.
THE USE OF ANY CLASS I OZONE-DEPLETING SUBSTANCE
(ODS) IN THE DESIGN, MANUFACTURING, TESTING,
CLEANING, OR ANY OTHER PROCESS FOR THIS ITEM
UNDER ANY MILITARY OR FEDERAL SPECIFICATION,
STANDARD OR DRAWING REFERENCED IN THIS ITEM
DESCRIPTION IS "PROHIBITED" UNLESS THE SEPARATE
WRITTEN APPROVAL OF THE CONTRACTING OFFICER IS
OBTAINED. THIS PROHIBITION SUPERSEDES ALL
SPECIFICATION REQUIREMENTS BUT DOES NOT
ALLEVIATE ANY PRODUCT PERFORMANCE REQUIREMENTS.
THIS DOES NOT APPLY TO COMMERCIAL ITEMS, AS
DEFINED IN "FAR 11.001" OR TO PART-NUMBERED
ONLY ITEMS.
SAMPLING:
THE SAMPLING METHOD SHALL BE IN ACCORDANCE WITH MIL-STD-1916 OR ASQ
H1331, TABLE 1 OR A COMPARABLE ZERO BASED SAMPLING PLAN UNLESS OTHERWISE
SPECIFIED BY THE CONTRACT. IF THE APPLICABLE DRAWING, SPECIFICATION,
STANDARD, OR QUALITY ASSURANCE PROVISION (QAP) SPECIFIES CRITICAL, MAJOR
AND/OR MINOR ATTRIBUTES, THEY SHALL BE ASSIGNED VERIFICAITON LEVELS OF
VII, IV AND II OR AQLS OF 0.1, 1.0 AND 4.0 RESPECTIVELY. UNSPECIFIED
ATTRIBUTES SHALL BE CONSIDERED AS MAJOR UNLESS SAMPLING PLANS ARE
SPECIFIED IN APPLICABLE DOCUMENTS. FOR MIL-STD-1916, THE MANUFACTURER
MAY USE THE ATTRIBUTE OR VARIABLE INSPECTION METHOD AT THEIR OPTION OR
PER THE CONTRACT. MIL-STD-105/ASQ Z1.4 MAY BE USED TO SET SAMPLE LOT
SIZE, BUT ACCEPTANCE WOULD BE ZERO NON-CONFORMANCES IN THE SAMPLE LOT
UNLESS OTHERWISE SPECIFIED IN THE CONTRACT.
FULL AND OPEN COMPETITION APPLIES.
REFERENCE MATERIAL
SELECTED ITEM
TDP Rev A Gen 2 IAW BASIC DRAWING NR 30003 2881122 REVISION NR AA DTD 02/05/1985 PART PIECE NUMBER: 2881122-1
TDP Rev A Gen 2 IAW REFERENCE DRAWING NR 30003 AS-2657 REVISION NR DTD PART PIECE NUMBER: AS-2657
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018954220 0001 EA 1.000
SPE7M5-27-T-1876
SECTION B
PR: 7018954220 PRLI: 0001 CONT’D
NSN/MATERIAL:5961010392321
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:ZZ
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:C
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
BULK BREAK POINT:
W90ADP
0010 CS BN CO A DISTRIBUTI
AWCF SSF SSA
BLDG 4475 CAMP SWIFT ROAD
FORT DRUM NY 13602-0000
US
RDD(3-POS RDD)/NMCS SHIPMENT. SHIP BY FASTAST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
SPE7M5-27-T-1876
SECTION B
PR: 7018954220 PRLI: 0001 CONT’D
W90ADP
0010 CS BN CO A DISTRIBUTI
AWCF SSF SSA
BLDG 4475 CAMP SWIFT ROAD
FORT DRUM NY 13602-0000
US
MARKFOR
W90ADP
0010 CS BN CO A DISTRIBUTI
AWCF SSF SSA
BLDG 4475 CAMP SWIFT ROAD
FORT DRUM NY 13602-0000
US
M/F: (TCN) W90ADP62680069
RDD: N
PROJ: TP 1
SUPP ADD: W9046W SIG: C
FOR GOVERNMENT USE ONLY: (IPD) 02
DIC: A0A DIST: V ADV: FC: Z9
Need Ship Date:00/00/0000 Original Required Delivery Date:10/30/2026
SPE7M5-27-T-1876 NSN/Part Number: 5961-01-039-2321 Quantity: 1 EA Purchase Request: 7018954220QTY: 1 Delivery: 5 days ADO