SEMICONDUCTOR DEVICE, D

SEMICONDUCTOR DEVICE,DIODE
SEMICONDUCTOR DEVIC
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M1-26-T-271R
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
SAAB AB (PUBL) BUSINESS AREA S5948 P/N RKZ323223/33
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017437588 0001 EA 3.000
NSN/MATERIAL:5961200070328
DELIVERY (IN DAYS):0136
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:C
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
ZZ = MOP BASED ON ESD STATUS:
1. ALL ESD SENSITIVE DEVICES ARE REQUIRED TO BE PACKAGED
IN ACCORDANCE WITH MIL-STD-2073-1, METHOD OF PRESERVATION
CODE "GX" NO WAIVERS OR DEVIATIONS PERMITTED.
2. FOR NON-SENSITIVE CIRCUIT CARD ASSEMBLIES, METHOD
OF PRESERVATION CODE 41 APPLIES.
COMMERCIAL PACKAGING SHALL NOT BE UTILIZED.
PACKAGE DESIGN PERFORMANCE CRITERIA INCLUDES SAFE
DELIVERY OF CIRCUIT CARD ASSEMBLIES TO ULTIMATE USER.
ZZ SPECIAL MARKING REQUIREMENTS:
SPE7M1-26-T-271R
SECTION B
PR: 7017437588 PRLI: 0001 CONT’D
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IF DEVICE IS CLASSIFIED AS ESD SENSITIVE, THEN
SPECIAL MARKING CODE 39 IS REQUIRED; USE ESD
PRECAUTIONARY PACKAGING, HANDLING, AND PROCESSING
PROCEDURES IN ACCORDANCE WITH MIL-STD-1686.
ATTENTION:
IF THIS DEVICE IS CLASSIFIED AS AN ELECTROSTATIC
DISCHARGE (ESD) SENSITIVE DEVICE AND/OR SUSCEPTIBLE TO ELECTROMAGNETIC
INTERFERENCE (EMI).
>>PRECAUTIONARY PACKAGING, HANDLING, AND
PROCESSING PROCEDURES SHALL BE USED TO PREVENT
DAMAGE FROM ELECTROSTATIC/ELECTROMAGNETIC AND
OTHER ENVIRONMENTAL FIELD FORCES.<<
THE CONTRACTOR/PACKAGER SHALL POSSESS THE FOLLOWING
FOUR MANDATORY ESD CAPABILITIES TO PROPERLY HANDLE
AND PACKAGE ESD SENSITIVE DEVICES:
1. SHALL HAVE AN ESD CONTROL PROGRAM (MIL-HDBK-263).
2. SHALL HAVE AN ESD WORKSTATION (MIL-HDBK-773).
ALL ITEMS AND PACKAGES SHALL BE HANDLED, PACKAGED,
AND OPENED AT AN APPROVED ESD WORKSTATION -OR
FIELD SERVICE KIT. FOR FURTHER INFORMATION,
CONSULT MIL-HDBK-773.
3. SHALL HAVE APPROVED PACKAGING MATERIALS BY QUALIFIED
SOURCES TO COMPLY WITH METHOD OF PRESERVATION "GX".
REQUIRED BARRIER BAG IS MIL-PRF-81705. (MIL-STD-2073-1D,
PARAGRAPH 5.2.4.1 AND APPENDIX J, TABLE J.Ia, Code GX)
4. EMPLOYEES SHALL BE TRAINED IN PROPER GROUNDING, HANDLING, AND PACKAGING OF ESD SENSITIVE DEVICES TO ENSURE PARTS ARE NOT COMPROMISED/EXPOSED TO ESD (MIL-HDBK-773).
NO WAIVERS OR DEVIATIONS TO THESE TECHNICAL REQUIREMENTS PERMITTED.
For more information on ESD visit: https://www.dla.mil/HQ/LogisticsOperations/Packaging/ PackFAQs/ESDS/
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M1-26-T-271R
SECTION B
PR: 7017437588 PRLI: 0001 CONT’D
PARCEL POST ADDRESS:
W62G2T
W1A8 DLA DIST SAN JOAQUIN
25600 S CHRISMAN RD
REC WHSE 57
TRACY CA 95304-5000
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
W62G2T
W1A8 DLA DIST SAN JOAQUIN
25600 S CHRISMAN ROAD
25600 S CHRISMAN RD REC WHSE 57
TRACY CA 95304-5000
US
Need Ship Date:01/05/2027 Original Required Delivery Date:02/26/2027
SPE7M1-26-T-271R NSN/Part Number: 5961-20-007-0328 Quantity: 3 EA Purchase Request: 7017437588QTY: 3 Delivery: 136 days ADO