This Solicitation opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Top

SEMICONDUCTOR DEVICE, D

Closed

SPE7M2-27-T-0052Federal

Submission Closed10/23/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 334413

New

DIBBS

Supply of Insulator Plate (NSN 5970004232896)This subcontract involves the manufacture and supply of insulator plates under NSN 5970004232896 for prime contractors supporting the Department of Defense DLA Weapons Support ASC Commodities Division. The contractor is responsible for sourcing or producing the hardware components in strict accordance with specified technical requirements, with a critical prohibition against the use of additive manufacturing or 3D printing. The agreement requires the delivery of physical components FOB Destination within a 20-day window. This procurement falls under NAICS code 334413 and is managed through the DLA, with performance associated with FPO 09514.

DLA WEAPONS SUPPORT ASC COMMODITIES DIVISION

POSTED

DEADLINE

Supplier of Semiconductor Device, Diode (NSN 5961-01-026-2577)This subcontract, issued by the Department of Defense DLA Weapons Support Active Devices Division, requires the supply of two semiconductor diode units under NSN 5961-01-026-2577. The hardware must be delivered to Tobyhanna, Pennsylvania, and the supplier is required to hold qualifications for FSC 5961 and 5962. Strict adherence to military standards is mandatory, including packaging per MIL-STD-2073-1E and MIL-DTL-19491, and marking per MIL-STD-129 and IPC/JEDEC J-STD-609. Additionally, the provider must maintain full supply chain traceability in accordance with DLAD Procurement Note C03. The response deadline for this requirement is November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Supply of Fixed Wire Wound Resistors (NSN 5905-01-063-8462)This subcontract involves the supply of 5,000 fixed wire wound resistors for prime contractors supporting DLA supply contracts. The components must be manufactured or sourced to meet NSN 5905-01-063-8462 specifications. All items require strict adherence to marking standards MIL-STD-129 and IPC/JEDEC J-STD-609, with packaging performed according to MIL-STD-2073-1E and RP001. The contract is managed by the Department of Defense under the DLA Weapons Support Active Devices Division, with performance taking place at Hill AFB. Compliance with the Buy American Act and DFARS 252.204-7012 is mandatory. The response deadline for this requirement is November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Supply of Flashlights (NSN 6230014688129)This subcontract involves the procurement or manufacture of 457 flashlights for prime contractors supporting the DLA Weapons Support Nuclear Reactor Program under the Department of Defense. All units must strictly adhere to the technical specifications for NSN 6230014688129, with detailed technical data accessible via the DLA portal. The contractor is responsible for packaging the items according to MIL-STD-2073-1E standards and shipping them FOB Origin to the place of performance in Tracy, California. The opportunity is categorized under NAICS code 334413, with a response deadline set for November 9, 2026.

DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM

POSTED

DEADLINE

Supply of Digital Microcircuits (NSN 5962-01-067-9523)This subcontract, issued by the DLA Weapons Support Active Devices Division of the Department of Defense, requires the supply of 115 digital microcircuits under NSN 5962-01-067-9523. The components must adhere to IPC/JEDEC J-STD-609 lead finish identification standards and be delivered with DLA Form 918 traceability documentation. To ensure component integrity, the contractor must utilize DOD qualified ESD/EMI protective packaging in accordance with MIL-PRF-81705, MIL-STD-2073-1E, and MIL-STD-129. The opportunity is designated as a Total Small Business Set-Aside under NAICS code 334413, with performance taking place in Columbus, Ohio. Prospective bidders are required to provide a CMMC Level 2 self-assessment. The solicitation was posted on October 28, 2026, with a response deadline of November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Fluorescent Lamp Supplier (NSN 6240-01-317-1381)This subcontract through the Defense Logistics Agency requires a supplier to provide 926 fluorescent lamps meeting NSN 6240-01-317-1381 specifications for Department of Defense prime contractors. The selected vendor must maintain an active SAM registration and ensure all materials are packaged according to ASTM D3951 and labeled in compliance with MIL-STD-129. The performance of this contract will take place in Phoenix, Arizona, under NAICS code 334413. Interested parties must submit their responses by the deadline of November 9, 2026.

Defense Logistics Agency

POSTED

DEADLINE

Supply of Waveguide Horn Covers (NSN 5985-00-545-4790)This subcontract involves the manufacture or procurement of seven waveguide horn covers, identified by NSN 5985-00-545-4790, for prime contractors supporting the Defense Logistics Agency Weapons Support Maritime Supply Chain. The selected provider must ensure all units are marked according to MIL-STD-129 and packaged in strict compliance with DLA requirement RP001. The contract falls under NAICS code 334413 and mandates rigorous security and data handling standards, specifically requiring CMMC Level 2 and DFARS 252.204-7012 compliance. Interested parties must submit their responses by November 9, 2026.

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN

POSTED

DEADLINE

Supplier of Memory Microcircuits (NSN 5962-01-567-9623)This subcontract involves the supply of eight memory microcircuits, specifically NSN 5962-01-567-9623, to prime contractors supporting the DLA Weapons Support Active Devices Division. The selected supplier is responsible for manufacturing or sourcing these components using cleanroom facilities and ESD-protected handling. Strict adherence to technical standards is required, including IPC/JEDEC J-STD-609 for lead finish markings and MIL-STD-2073-1E and MIL-STD-129 for packaging. The contract mandates compliance with the Buy American Act and DFARS cybersecurity regulations. Deliveries must be accompanied by DLA Form 918 and full traceability documentation. Performance for this requirement is centered in Columbus, Ohio, under NAICS code 334413, with a response deadline of November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Supply of Push Switches (NSN 5930-01-062-4904)This subcontract involves the supply of push switches identified by NSN 5930-01-062-4904 for prime contractors supporting the Department of Defense DLA Weapons Support Maritime Supply Chain. The selected source or manufacturer must provide one unit of the specified switch, ensuring compliance with RP001 packaging requirements and strict mercury-free material restrictions. The use of approved additive manufacturing processes is permitted to meet the technical specifications. The opportunity is categorized under NAICS code 334413 and was posted on October 28, 2026, with a response deadline of November 9, 2026. All deliverables must be packaged according to DLA specifications to ensure successful integration into the maritime supply chain.

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN ESOC BUYS

POSTED

DEADLINE

Supply of Sealed Lead Acid Battery Type I (NSN 6130016325119)

Defense Logistics Agency

POSTED

DEADLINE

Air Transducer Assembly ManufacturingThis subcontract involves the manufacture and assembly of 115 calibrated air transducer units for prime contractors supporting DLA Troop Support supply contracts. The scope of work includes precision machining, assembly, and calibration of the transducer sensor and housing in strict accordance with NSN 4930-01-535-7810. Performance must adhere to the RA001 DLA Master List and the Buy American Act, with a specific prohibition against the use of additive manufacturing. The project is managed under NAICS code 334413 for the Department of Defense, with the place of performance located in New Cumberland, Pennsylvania. Interested parties must note the response deadline of November 9, 2026, for this specialized production requirement.

CONSTRUCTION & EQUIPMENT MANU & CON

POSTED

DEADLINE

Supplier of Light Emitting Diode (NSN 5980-01-724-8546)This subcontract opportunity is issued by the Department of Defense DLA Weapons Support Active Devices Division for the procurement of one Light Emitting Diode under NSN 5980-01-724-8546. The selected supplier must source or produce the component in strict accordance with the specified NSN and the DLA Master List of Technical and Quality Requirements RA001. All components must be packaged according to MIL-STD-2073-1E, and the use of additive manufacturing is strictly prohibited. Eligible bidders must possess a valid CAGE code and Unique Entity ID to participate. The contract requires the delivery of the LED to a designated inspection point in FPO 96616. Responses to this solicitation are due by November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 5 hours ago

DEADLINE

in 12 days

AI Contract Overview

Solicitation SPE7M2-27-T-0052 is a fixed-price procurement issued by the DLA Weapons Support Nuclear Reactor Program for the acquisition of semiconductor diode devices, specifically part number JANTX1N1190 under NSN 5961-00-154-7046. The requirement is split into two line items: CLIN 0001 for 112 units to be delivered to DLA Distribution Depot Oklahoma and CLIN 0002 for 123 units to be delivered to DLA Distribution Warner Robins. Delivery is specified as FOB Origin with a delivery period of 106 days, and the items are designated as critical application items. The contract mandates strict adherence to quality and technical standards, requiring components to be sourced from the Qualified Products List or Qualified Manufacturers List. Technical compliance includes following MIL-PRF-19500/297K and MIL-PRF-19500R. Packaging and preservation must comply with MIL-DTL-19491 and MIL-STD-2073-1E, while marking must align with MIL-STD-129 and IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the contractor must maintain supply chain traceability documentation and ensure that no mercury or mercury compounds are used in preservation or packaging. Administrative requirements include CMMC Level 2 self-assessment and compliance with DFARS safeguarding of covered defense information. All quotes must be submitted via the DLA Internet Bid Board System (DIBBS). Inspection and acceptance will occur at the destination. The procurement is governed by NAICS code 334413 and incorporates various FAR and DFARS clauses regarding the Buy American Act, cybersecurity, and the prohibition of covered defense telecommunications equipment.

General Info

Fixed-price procurement for 235 semiconductor diode devices for the DLA Weapons Program.

Agency

Department Of Defense → DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

3301 F AVE CEN REC BLDG 506 DR 22, TINKER AFB, OK, 73145-8000, USA

Set-Aside

NONE

Documents

RFQ SPE7M2-27-T-0052

22 pages · rfq

High

AI Contract Breakdown

Uniform Contract Format

Timeline

PhaseClosed

PostedOct 12

Solicitation

Response DeadlineOct 23

Deadline has passed

Submission Closed

10/23/2026, 05:00:00 PM UTC

Find active opportunities like this

Get full access to discover similar active contracts, track opportunities, and build proposals with AI assistance.

Organization & Contact Information

AgencyDepartment Of Defense → DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM

Contacts1 person available

OfficeUSA

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM

Office AddressUSA

Contacts

David Larsen

contact@example.gov

+1 (555) 000-0000

Full Description

SEMICONDUCTOR DEVICE,DIODE
SEMICONDUCTOR DEVICE,DIODE
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M2-27-T-0052
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD002, COVERED DEFENSE INFORMATION APPLIES
THIS NSN IS LISTED AS A PRIMARY QPL OR QML THEREFORE
THE QUALIFIED PRODUCTS LIST OR QUALIFIED MANUFACTURERS
LIST IS APPLICABLE.
RQ007: QUALIFIED MANUFACTURERS LIST (QML) INTEGRATED CIRCUITS, HYBRID
MICROCIRCUITS, AND SEMICONDUCTOR DEVICES DLA MARITIME
THIS NSN CONTAINS ONE OR MORE COMPONENTS WHICH MUST MEET QPL/QML
REQUIREMENTS. BY SUBMITTING AN OFFER, THE OFFEROR AGREES TO PROVIDE
QPL/QML COMPONENTS ONLY FROM SOURCES QUALIFIED ON THE APPLICABLE
QPL(S)/QML(S).
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment MERCURY OR MERCURY CONTAINING COMPOUNDS SHALL NOT BE INTENTIONALLY ADDED TO<(>,<)> OR COME IN DIRECT CONTACT WITH<(>,<)> ANY HARDWARE OR SUPPLIES FURNISHED UNDER THIS CONTRACT. EXCEPTION: FUNCTIONAL MERCURY USED IN BATTERIES, FLUORESCENT LIGHTS, REQUIRED INSTRUMENTS; SENSORS OR CONTROLS; WEAPON SYSTEMS; AND CHEMICAL ANALYSIS REAGENTS SPECIFIED BY NAVSEA. PORTABLE FLUORESCENT LAMPS AND PORTABLE INSTRUMENTS CONTAINING MERCURY SHALL BE SHOCK PROOF AND CONTAIN A SECOND BOUNDARY OF CONTAINMENT OF THE MERCURY OR MERCURY COMPOUND. (IAW NAVSEA 5100-003D).
CRITICAL APPLICATION ITEM
TDP Rev A Gen 1 IAW BASIC SPEC NR MIL-PRF-19500/297K(1) REVISION NR K DTD 12/21/2020 PART PIECE NUMBER: JANTX1N1190
TDP Rev A Gen 1 IAW REFERENCE SPEC NR MIL-PRF-19500R(1) REVISION NR R DTD 02/06/2026 PART PIECE NUMBER: JANTX1N1190
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018684134 0001 EA 112.000
NSN/MATERIAL:5961001547046
DELIVERY (IN DAYS):0106
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
SPE7M2-27-T-0052
SECTION B
PR: 7018684134 PRLI: 0001 CONT’D
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:Z PRESV MAT:00
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:Z
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:ZZZ
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
IP056: MERCURY OR MERCURY COMPOUNDS ARE PROHIBITED IN PRESERVATION,
PACKAGING, PACKING AND MARKING.
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
SW3211
DLA DISTRIBUTION DEPOT OKLAHOMA
3301 F AVE CEN REC BLDG 506 DR 22
TINKER AFB OK 73145-8000
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW3211
SPE7M2-27-T-0052
SECTION B
PR: 7018684134 PRLI: 0001 CONT’D
DLA DISTRIBUTION DEPOT OKLAHOMA
3301 F AVE CEN REC BLDG 506 DR 22
TINKER AFB OK 73145-8000
US
Need Ship Date:10/08/2026 Original Required Delivery Date:06/06/2027
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0002 7018684134 0002 EA 123.000
NSN/MATERIAL:5961001547046
DELIVERY (IN DAYS):0106
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:Z PRESV MAT:00
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:Z
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:ZZZ
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
IP056: MERCURY OR MERCURY COMPOUNDS ARE PROHIBITED IN PRESERVATION,
PACKAGING, PACKING AND MARKING.
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in
SPE7M2-27-T-0052
SECTION B
PR: 7018684134 PRLI: 0002 CONT’D
accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:Z PRESV MAT:00
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:Z
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:ZZZ
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
IP056: MERCURY OR MERCURY COMPOUNDS ARE PROHIBITED IN PRESERVATION,
PACKAGING, PACKING AND MARKING.
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
SW3119
DLA DISTRIBUTION WARNER ROBINS
455 BYRON STREET
BLDG 376
ROBINS A F B GA 31098-1887
SPE7M2-27-T-0052
SECTION B
PR: 7018684134 PRLI: 0002 CONT’D
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SW3119
DLA DISTRIBUTION WARNER ROBINS
455 BYRON STREET BLDG 376
ROBINS A F B GA 31098-1887
US
Need Ship Date:10/08/2027 Original Required Delivery Date:06/06/2027
SPE7M2-27-T-0052 NSN/Part Number: 5961-00-154-7046 Quantity: 112 EA Purchase Request: 7018684134QTY: 235 Delivery: 106 days ADO