This Government Contract opportunity from Department Of Defense was posted on July 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Semiconductor Device Fabrication
Contract Overview
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The contract pertains to the full process flow fabrication of optoelectronic and power semiconductor devices, encompassing essential manufacturing steps such as lithography, etching, metallization, and passivation. This subcontract is issued by the Naval Research Laboratory under the Department of Defense and requires specialized capabilities to produce advanced semiconductor structures with precision and reliability. The work is to be performed at a facility in Washington, with a zip code of 20375, indicating the operation is localized to the D.C. metro area. The NAICS code 334418 identifies the primary industrial classification as semiconductor and other electronic component manufacturing, underscoring the technical nature of the required services. The solicitation was posted on July 29, 2026, with a firm deadline for responses on August 13, 2026, at 7:00 PM Eastern Time. No set-aside designation is specified, meaning the opportunity is open to all eligible contractors regardless of size or certification status. The contract lacks a designated point of contact, suggesting that all inquiries must be directed through official SAM.gov channels. Interested parties must submit proposals before the deadline to be considered for participation in this high-precision fabrication effort supporting defense-related optoelectronic and power device development.
General Info
Agency
NAICS
Place of Performance
Washington, DC, 20375, USASet-Aside
Documents
This scope was carved out of N0017326RMR04.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Optoelectronics, Power Electronics, and Radiation Effects Research
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Timeline
Submission Closed
Organization & Contact Information
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