SEMICONDUCTOR DEVICE S

This contract is for the procurement of a semiconductor device set, designated by NSN 5961013567809 and part number 10075-1365-02, with a quantity of 81 units to be delivered within 236 days after order placement. The delivery is FOB origin, with inspection and acceptance occurring at the destination point at the DLA Distribution DDSP New Cumberland Facility in New Cumberland, Pennsylvania. All items must be individually packaged in MIL-PRF-81705 heat-sealed barrier bags for ESD protection, then over-packaged as a set, with cushioning and packaging materials complying with MIL-STD-2073-1E and RP001 DLA packaging standards. Palletization must follow DLA requirements, and individual unit packaging must be marked in accordance with MIL-STD-129, including special code ZZ for ESD sensitivity and omission of item nomenclature due to export control status. Lead finish markings must conform to IPC/JEDEC J-STD-609, identifying lead content, and all ESD/EMI protective materials must be sourced from qualified manufacturers listed on QPL-81705. The item is restricted from containing mercury or mercury compounds except in specified exceptions such as batteries, sensors, and weapons systems, with portable devices requiring shockproof construction and secondary containment. The contractor must retain supply chain traceability documentation as required by DLAD Procurement Note C03 and ensure qualification under the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for FSC 5961 and 5962. Compliance with FAR and DFARS clauses including equal opportunity, combating trafficking, employment verification, safeguarding information systems, and NIST SP 800-171 assessments is mandatory. Hazardous materials require SDS submission per 29 CFR 1910.1200 and additional labeling under 252.223-7001 and 252.223-3, with updates required during performance. The contract is subject to a small business set-aside under SBA rules, and contractors must submit accurate Unique Entity ID and CAGE code information. Payments are processed electronically via WAWF, and proposals must be submitted through DIBBS by the stated deadline. No unit price or total contract value is provided, and evaluation factors beyond technical acceptability and