Semiconductor Die Fabrication and Wafer Processing

The contract pertains to the manufacturing of semiconductor die and wafer processing for digital microcircits tailored to meet rigorous military specifications. The scope of work encompasses critical fabrication processes including lithography, etching, doping, and metallization, all executed to ensure performance, reliability, and compliance with defense-grade standards. The work is intended for use in mission-critical military applications, requiring precision, traceability, and strict adherence to technical and quality control requirements inherent in defense electronics production. The contract is categorized as a subcontract under the NAICS code 334412, which designates semiconductor and related device manufacturing. It is managed by the Active Devices Division of the Department of Defense, with performance location specified in Columbus, Ohio, zip code 43213. The solicitation was posted on July 5, 2026, with a response deadline of July 16, 2026, providing prospective vendors a narrow window to submit proposals. No set-aside designation is specified, indicating the opportunity is open to any qualified entity capable of fulfilling the defense-level manufacturing requirements.