This Government Contract opportunity from Department Of Defense was posted on July 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Semiconductor Die Fabrication and Wafer Processing

Closed

Federal

Submission Closed07/16/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

Solicitation # SPE7M5-27-T-1591

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

CIRCUIT CARD ASSEMBLY

Solicitation # SPE7M1-27-T-0840

Solicitation SPE7M1-27-T-0840 is a fixed-price request for quotations issued by the DLA Weapons Support Maritime Supply Chain for the procurement of eight circuit card assemblies. The required hardware is identified by NSN 5998-01-628-2855 and corresponds to GE Fanuc Embedded Systems Inc. part number PMC942RC. The original required delivery date is June 26, 2027, with a need ship date of June 12, 2027. Delivery is established as FOB Origin, with inspection and acceptance occurring at the destination, specifically the DLA Distribution DDSP New Cumberland facility in Pennsylvania. The contract mandates strict adherence to technical and quality standards, including MIL-STD-2073-1E for packaging and MIL-STD-129 for marking. Compliance with CMMC Level 2 Self-Assessment and NAVSEA 5100-003D regarding mercury containment is required. Additionally, the solicitation prohibits the use of additive manufacturing for the produced items and incorporates the Buy American Act and various DFARS regulations regarding covered defense telecommunications and hazardous materials. Payment and receiving reports must be processed electronically through the Wide Area WorkFlow system.

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN

POSTED

DEADLINE

Solicitation # SPE7M5-27-T-1585

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

CIRCUIT CARD ASSEMBLY

Solicitation # SPE7M1-27-T-1665

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN

POSTED

DEADLINE

Circuit Card Assembly Fabrication and AssemblyThis subcontract involves the fabrication and assembly of Circuit Card Assemblies to support DLA supply contracts for the Department of Defense, specifically through the Pa DLA Aviation At Philadelphia. The scope of work includes fabricating printed circuit boards, sourcing and populating components using SMT or through-hole assembly, and performing functional verification with testing equipment. The primary deliverable consists of three units of NSN 5998-01-462-4333. The contractor must ensure strict compliance with the Buy American Act regarding domestic origin requirements. Additionally, the provider is responsible for reporting end items via IUID through the IUID Registry or WAWF. This opportunity falls under NAICS code 334412, with a response deadline set for November 6, 2026.

Pa DLA Aviation At Philadelphia

POSTED

DEADLINE

59--CIRCUIT CARD ASSEMB, IN REPAIR/MODIFICATION OF

Solicitation # N0010426QYAJB

Solicitation N0010426QYAJB is a fixed-price request for quotations issued by the Navsup Weapon Systems Support Mech for the teardown, evaluation, repair, and modification of a circuit card assembly, NSN 5998-01-577-3864. The contractor is required to perform all work in accordance with original manufacturer specifications and drawings, adhering to strict quality standards including ANSI/ESD S20.20 for electrostatic discharge control and a total prohibition of metallic mercury to prevent contamination on submarines and surface ships. Delivery is required within 111 days on a FOB Destination basis, with all items physically identified and packaged according to MIL-STD-129, MIL-STD-130, and MIL-STD-2073. Due to the nature of the equipment, the contractor must possess a government security clearance and authorized access to Secret level classified documents as detailed in DD Form 254. Award evaluations will be based on Supplier Performance Risk System assessments regarding item, price, and supplier risk. The contractor must maintain inspection records for 365 days following final delivery and utilize the Wide Area Workflow system for electronic invoicing. Additional compliance is required for cybersecurity maturity model certification and the detection and avoidance of counterfeit electronic parts.

Navsup Weapon Systems Support Mech

POSTED

DEADLINE

59--CIRCUIT CARD ASSEMB

Solicitation # N0010426QYAF8

Solicitation N0010426QYAF8, issued by the Department of the Navy's NAVSUP Weapon Systems Support Mech, is a request for quotations for the manufacture and delivery of a Circuit Card Assembly (NSN 5998-01-616-3772). The procurement requires strict adherence to Technical Data Package version 002 and mandates that the supplier maintain a quality system compliant with ISO 9001 or MIL-I-45208. Key technical requirements include compliance with ANSI/ESD S20.20 for electrostatic discharge control and a strict mercury-free mandate for use on submarines and surface ships. The contract includes an option for additional quantities up to 100 percent for 365 days after receipt of the order. The government will evaluate offers based on the Supplier Performance Risk System, focusing on item, price, and supplier risk, while prioritizing U.S.-made or qualifying country end products. Award consideration is limited to original equipment manufacturers or authorized distributors who can provide a signed letter of authorization. Deliverables must be marked per MIL-STD-129 and packaged according to MIL-STD-2073-1, with specific packing levels based on the destination. Inspection and acceptance will occur at the origin, and all payment requests must be processed electronically through the Wide Area Workflow system. Following two amendments, the final response deadline for offers is October 28, 2026.

Navsup Weapon Systems Support Mech

POSTED

DEADLINE

59--CIRCUIT CARD ASSEMB

Solicitation # N0010426QYAES

Solicitation NO0104-26-Q-YAES is a small business set-aside request for quotations issued by the Department of the Navy, NAVSUP Weapon Systems Support Mech, for the manufacture and delivery of circuit card assemblies (NSN 5998-01-577-3862). The required items must conform to the design represented by Cage Code 03538 and reference number 77C733426G1, utilizing TDP Version 002. Key technical requirements include strict adherence to ANSI/ESD S20.20 for electrostatic discharge control and a total prohibition of metallic mercury to prevent corrosion and toxicity on submarines and surface ships. The contract specifies a delivery timeline of 180 days with FOB Destination terms and requires a one-year warranty from the date of delivery. The procurement process includes several critical compliance and quality standards. Items must be physically identified per MIL-STD-130 and packaged according to MIL-STD-2073, with specific labeling requirements for Depot Level Repairable items. Inspection and acceptance will occur at the origin, with the contractor holding primary responsibility for quality assurance. Offerors who are not the original equipment manufacturer must provide a signed letter of authorization on OEM letterhead. Evaluation of quotes will be based on Supplier Performance Risk System assessments, focusing on item, price, and supplier risk. All invoicing and receiving reports must be processed electronically through the Wide Area WorkFlow system.

Navsup Weapon Systems Support Mech

POSTED

DEADLINE

59--CIRCUIT CARD ASSEMB

Solicitation # N0010426QYAF9

Solicitation N00104-26-Q-YAF9, issued by NAVSUP Weapon Systems Support Mechanicsburg, seeks quotations for the manufacture and delivery of a circuit card assembly, identified by NSN 5998-01-680-8202 and Cage Code 03538. The requirement is processed under Emergency Acquisition Flexibilities and is DO certified for national defense. The government maintains an option to order an additional quantity of up to 100 percent of the original order at the same price for 365 days after receipt of order. The closing date for the receipt of offers has been extended to November 05, 2026. The contractor must adhere to strict quality and technical standards, including ISO 9001 quality system requirements and ANSI/ESD S20.20 for electrostatic discharge control. Supplies must be mercury-free and packaged according to MIL-STD-2073-1 and marked per MIL-STD-129. Delivery is required within 180 days, FOB Destination, with inspection and acceptance occurring at the origin. A one-year warranty from the date of delivery is required for these noncomplex supplies. Offerors who are not the Original Equipment Manufacturer must provide a signed letter of authorization on the OEM's letterhead to be considered for award. Invoicing and payment will be processed electronically via Wide Area Workflow.

Navsup Weapon Systems Support Mech

POSTED

DEADLINE

Solicitation # SPRPA127QZA36

Solicitation SPRPA127QZA36, issued by DLA Aviation at Philadelphia, is a request for quotations for five newly manufactured Circuit Card Assemblies (NSN 5998-01-728-8235). This procurement is designated for Critical Safety Items (CSI) and Critical Application Items (CAI), requiring strict adherence to quality management standards such as AS/EN/JISQ 9100 or an equivalent system. The government will make a single award based on the most advantageous offer, with past performance weighted as more important than price. Proposals are due by November 6, 2026, and must be submitted to the primary point of contact, Naseem Aoun. The contract mandates that all supplies be newly manufactured; refurbished or repaired materials are ineligible for award. Offerors must be government-approved sources of supply, and authorized distributors must provide a formal authorization letter on the source's letterhead at the time of proposal. Technical requirements include strict packaging and marking standards per MIL-STD-2073 and MIL-STD-129, with specific electrostatic discharge protection required for sensitive items. Administrative requirements include the use of the Wide Area Workflow (WAWF) system for invoicing and receiving reports, with delivery terms set as FOB Destination.

Pa DLA Aviation At Philadelphia

POSTED

DEADLINE

59--CIRCUIT CARD ASSEMB

Solicitation # N0010426QYAEQ

This solicitation, issued by NAVSUP Weapon Systems Support, is for the manufacture and procurement of a circuit card assembly under NAICS code 334412. The requirement is processed under Emergency Acquisition Flexibilities and is DO certified for national defense under the Defense Priorities and Allocations System. The government maintains an option to order an additional quantity of up to 100 percent for 365 days after receipt of the order at the same price. The resultant award will be issued bilaterally, requiring written acceptance from the contractor. Key technical requirements include strict adherence to electrostatic discharge control standards and a total prohibition of metallic mercury contamination, as the items are intended for use on submarines and surface ships. Quality assurance must comply with MIL-I-45208 or ISO 9001 standards, and the contractor is responsible for all inspection requirements. Offerors who are not the original equipment manufacturer must provide a signed letter of authorization from the OEM to be considered. The solicitation closing date was extended via Amendment 0001 to September 23, 2026.

Navsup Weapon Systems Support Mech

POSTED

DEADLINE

Solicitation # N0010427QLA02

Solicitation NO00104-27-Q-LA02 is a Request for Quotations issued by the NAVSUP Weapon Systems Support Mech for the teardown, evaluation, repair, and potential modification of a Computer CCA (NSN 5998-01-600-9910). The contractor is required to ensure the repaired item meets all operational and functional requirements using approved repair standards and manuals. Key performance metrics include a required Repair Turnaround Time (RTAT) of 170 days, measured from the physical receipt of the asset to final government acceptance. The contract mandates Government Source Inspection (GSI) and requires the contractor to maintain inspection records for 365 days following final delivery. Compliance requirements include strict adherence to MIL-STD-130 for physical identification and MIL-STD-129 and MIL-STD-2073-1 for packaging and marking. All shipments are FOB Origin, and electronic invoicing must be processed through the Wide Area Workflow system. Award consideration is limited to authorized distributors of the original manufacturer, with evaluations based on price and past performance as tracked via the DoD Supplier Performance Risk System. Additionally, offerors must provide CMMC unique identifiers and comply with various DFARS and FAR clauses regarding cybersecurity, the Buy American Act, and the safeguarding of covered defense information.

Navsup Weapon Systems Support Mech

POSTED

about 22 hours ago

DEADLINE

in about 2 months

AI Contract Overview

The contract pertains to the manufacturing of semiconductor die and wafer processing for digital microcircits tailored to meet rigorous military specifications. The scope of work encompasses critical fabrication processes including lithography, etching, doping, and metallization, all executed to ensure performance, reliability, and compliance with defense-grade standards. The work is intended for use in mission-critical military applications, requiring precision, traceability, and strict adherence to technical and quality control requirements inherent in defense electronics production. The contract is categorized as a subcontract under the NAICS code 334412, which designates semiconductor and related device manufacturing. It is managed by the Active Devices Division of the Department of Defense, with performance location specified in Columbus, Ohio, zip code 43213. The solicitation was posted on July 5, 2026, with a response deadline of July 16, 2026, providing prospective vendors a narrow window to submit proposals. No set-aside designation is specified, indicating the opportunity is open to any qualified entity capable of fulfilling the defense-level manufacturing requirements.

General Info

Manufacture military-grade semiconductor die and wafers in Columbus, Ohio, to defense specifications by July 16, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-297L.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITA

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedJul 5

subcontract

Response DeadlineJul 16

Deadline has passed

Submission Closed

07/16/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Manufacturing of semiconductor die and wafer processing for the digital microcircuit, including lithography, etching, doping, and metallization to meet military specifications.