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This Government Contract opportunity from Department Of Defense was posted on September 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor/Electronic Device Manufacturing

Closed
Federal

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This subcontract opportunity with the Department of Defense Active Devices Division involves the manufacture and supply of primary electronic components and assemblies for prime contractors fulfilling DLA supply contracts. The selected provider will utilize semiconductor fabrication equipment or electronic assembly lines to produce devices that strictly adhere to RFQ technical specifications and DLA quality standards. The project is categorized under NAICS code 334413 and will be performed in New Cumberland, Pennsylvania. Interested parties must submit their responses by September 21, 2026, following the posting date of September 10, 2026.

General Info

DoD subcontract for electronic components in Pennsylvania; responses due by September 21, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-471L.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

LIGHT EMITTING DIODE

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures and supplies primary electronic components or assemblies for prime contractors delivering DLA supply contracts. Produces electronic devices in accordance with RFQ technical specifications using semiconductor fabrication equipment or electronic assembly lines. Adheres to quality standards associated with DLA electronic procurements. Delivers finished electronic components and assemblies.

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