This Government Contract opportunity from Department Of Defense was posted on August 31, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Semiconductor Packaging and Compliance Labeling
Contract Overview
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The Semiconductor Packaging and Compliance Labeling subcontract, issued by the Department of Defense Active Devices Division, involves providing specialized preservation, packaging, and technical marking services for semiconductor components. The contractor is responsible for ensuring all units meet strict regulatory standards, including applying Lead and Pb-Free unit pack markings according to IPC/JEDEC J-STD-609, executing preservation per MIL-DTL-19491, and applying shipment markings in accordance with MIL-STD-129. To maintain component integrity, the work requires the use of ESD-safe packaging and precision labeling equipment to deliver fully preserved and labeled units. The performance of this contract is located in Tracy, California, under NAICS code 561990. Interested parties must adhere to the response deadline of September 11, 2026.
General Info
Place of Performance
TRACY, CA, 95304-5000, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-455M.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
SEMICONDUCTOR DEVIC
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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