This Government Contract opportunity from Department Of Defense was posted on April 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Sensor Packaging & Enclosure Design
Contract Overview
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AI Contract Overview
The contract focuses on the design and fabrication of protective, lightweight enclosures specifically for miniature sensors. These enclosures must provide moisture resistance, maintain thermal stability, and ensure structural integrity, which are critical for the performance and durability of the sensors under various environmental conditions. The work supports the development of advanced sensor packaging solutions tailored for demanding applications. Issued by the Department of Defense, the subcontract is associated with NAICS code 339999, indicating it falls within specialized manufacturing services. The place of performance is Aberdeen Proving Ground, reflecting its connection to defense-related research and development activities. The solicitation was posted on April 2, 2026, with responses due by June 17, 2026. The contract emphasizes precision engineering and materials expertise to meet rigorous military standards.
General Info
Place of Performance
Aberdeen Proving Ground, MD, USASet-Aside
Documents
This scope was carved out of W911SR-JPM-CBRN-IEW.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Request for Information: CPE CBRND Seeking Miniature Sensing Elements for Chemical and Biological Threat Detection
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → W6QK Acc-apg
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