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This Government Contract opportunity from Department Of Defense was posted on July 17, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Sensor System Integration & Packaging

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334511
New
DIBBS
CAP, LENS
Solicitation # SPE4A7-26-T-3917
Solicitation SPE4A7-26-T-3917 is a firm-fixed-price request for quotations issued by DLA Aviation for the procurement of 181 units of lens caps, identified by NSN 5895011742462. The items must be manufactured in accordance with basic drawing 80063 SM-D-804553, revision N dated September 14, 2006. Delivery is required within 171 days after receipt of order, with a need ship date of May 17, 2026, and an original required delivery date of October 11, 2026. Shipping is FOB Origin, with inspection and acceptance occurring at the destination, specifically the DLA Distribution DDSP New Cumberland facility in Pennsylvania. The contract mandates strict adherence to quality and technical standards, including the DLA Master List of Technical and Quality Requirements and a manufacturer's inspection system complying with SAE AS9003 or ISO 9001. Sampling must follow MIL-STD-1916 or ASQ H1331, and the use of Class I ozone-depleting substances is prohibited. Packaging must comply with ASTM D3951 and MIL-STD-129, with palletization following RP001. Security requirements include CMMC Level 2 self-assessment and compliance with DFARS 252.204-7012 for safeguarding covered defense information. Additionally, the solicitation incorporates the Buy American Act and Berry Amendment restrictions, while offering a price evaluation preference for certified HUBZone small business concerns.
ASC SUPPLIER OPER AE AND AF DIV

POSTED

1 day ago

DEADLINE

in 4 days

AI Contract Overview

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The contract seeks the integration of focal plane arrays, return on investment calculations, and thermal cooling systems into ruggedized, field-deployable sensor modules designed for operation across terrestrial, maritime, air, and space environments. These modules must withstand extreme conditions while maintaining high-performance thermal and electro-optical functionality, ensuring reliability in demanding operational scenarios. The work emphasizes compact packaging, durability, and seamless system-level integration to support deployment on diverse mobile and remote platforms without compromising sensor fidelity or operational readiness. This subcontract falls under NAICS code 334511 for electromedical and electrotherapeutic equipment manufacturing, though the scope clearly targets advanced sensor system development rather than medical applications. The opportunity is posted by the Defense Advanced Research Projects Agency under the Department of Defense with a response deadline of August 14, 2026. No set-aside provisions or specific eligibility criteria are indicated, and performance is expected to occur on a national scale without a defined geographic restriction. The contract requires proven expertise in packaging sensitive electro-optical components for harsh environments and the ability to deliver integrated systems that meet rigorous military and aerospace standards for size, weight, power, and thermal management.

General Info

Integrate focal plane arrays and thermal systems into ruggedized sensor modules for military and aerospace use.

Agency

Department Of Defense → Defense Advanced Research Projects AgcyView Agency

NAICS

334511 - Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument ManufacturingView NAICS

Place of Performance

VA

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-26-94.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Infrared Focal Plane Arrays

AI Contract Breakdown

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Advanced Research Projects Agcy
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Integration of FPA, ROIC, and cooling into ruggedized, field-deployable modules for terrestrial, maritime, air, or space platforms.

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NAICS: 541714
New
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Industry Day: DARPA Documentation & Decision Support Sprint (D2)
Solicitation # DARPA-SN-26-118
The Defense Advanced Research Projects Agency (DARPA) Biological Technologies Office (BTO) has issued Special Notice DARPA-SN-26-118 to announce a virtual Industry Day on September 22, 2026, for the Documentation and Decision Support Sprint (D2). This initiative aims to advance combat medicine by developing autonomous solutions that use passive sensor data, such as audio, video, and accelerometry, to assist untrained individuals in delivering tactical combat casualty care during the first 20 minutes of treatment. The project is divided into two primary lanes: Lane 1 focuses on the autonomous population of digital DD Form 1380 TCCC Cards, and Lane 2 focuses on providing real-time clinical decision support for non-medics based on Committee on Tactical Combat Casualty Care and Joint Trauma System Clinical Practice Guidelines. This announcement is an informational notice and not a formal solicitation for proposals or abstracts. Interested U.S. entities and citizens must register for the Industry Day by September 20, 2026, at 5:00 PM ET, with attendance limited to the first 1,000 registrants. While no formal proposals are being accepted, prospective competitors may submit one-page teaming profiles to D2Sprint@darpa.mil by September 22, 2026, to facilitate partnership arrangements. The D2 effort will be conducted at the unclassified level and will utilize targeted prize incentives to catalyze technological advancements. Technical and administrative inquiries are directed to Dr. Jeremy Pamplin and the D2Sprint email address.
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The Defense Advanced Research Projects Agency (DARPA) Multi X Office is soliciting innovative proposals under solicitation DARPA-PS-26-127, titled Perrseus, to develop microscale ultra-high-vacuum systems (uUHV). The program aims to enable compact cold-atom devices and environmentally-decoupled ultra-high Q microelectromechanical (MEMS) and photonics devices, specifically targeting manufacturable vacuum packages with pressures below 10^-10 mbar. The effort is structured as an Other Transaction for Prototype Agreement under 10 U.S.C. 4022, with an estimated period of performance of 42 months starting January 15, 2027. This includes a three-month Phase 0 for security set-up followed by technical development phases. Proposals are evaluated based on overall scientific and technical merit, potential contribution to the DARPA mission, and budget, price, and schedule. Key requirements include CMMC Level 2 self-assessment and strict adherence to Controlled Unclassified Information (CUI) handling guidelines. The program emphasizes low Size, Weight, and Power (SWaP) and high-volume manufacturability. Awardees must deliver ten functional prototypes and undergo in-person government validation of vacuum metrics. The submission process requires a technical and management volume, a detailed price volume, and an oral presentation, with a final proposal deadline of September 23, 2026.
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