This Government Contract opportunity from Department Of Defense was posted on July 17, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Sensor System Integration & Packaging
Contract Overview
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AI Contract Overview
The contract seeks the integration of focal plane arrays, return on investment calculations, and thermal cooling systems into ruggedized, field-deployable sensor modules designed for operation across terrestrial, maritime, air, and space environments. These modules must withstand extreme conditions while maintaining high-performance thermal and electro-optical functionality, ensuring reliability in demanding operational scenarios. The work emphasizes compact packaging, durability, and seamless system-level integration to support deployment on diverse mobile and remote platforms without compromising sensor fidelity or operational readiness. This subcontract falls under NAICS code 334511 for electromedical and electrotherapeutic equipment manufacturing, though the scope clearly targets advanced sensor system development rather than medical applications. The opportunity is posted by the Defense Advanced Research Projects Agency under the Department of Defense with a response deadline of August 14, 2026. No set-aside provisions or specific eligibility criteria are indicated, and performance is expected to occur on a national scale without a defined geographic restriction. The contract requires proven expertise in packaging sensitive electro-optical components for harsh environments and the ability to deliver integrated systems that meet rigorous military and aerospace standards for size, weight, power, and thermal management.
General Info
Agency
NAICS
Place of Performance
VASet-Aside
Documents
This scope was carved out of DARPA-SN-26-94.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Infrared Focal Plane Arrays
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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