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This Government Contract opportunity from Department Of Defense was posted on September 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

SMT and Through-Hole Assembly Services

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418
New
DIBBS
ELECTRONIC MODULE, STAN
Solicitation # SPE7M5-27-T-0997
Solicitation SPE7M5-27-T-0997, issued by the DLA Weapons Support Active Devices Division, is for the procurement of one standardized electronic module, identified by NSN 5963013531602 and Key Code CZJ. The requirement specifies a delivery timeline of 20 days with a required delivery date of October 13, 2026, shipped FOB Destination to the USS SEAWOLF SSN 21. The procurement is subject to strict quality and environmental standards, including a prohibition on Class I ozone-depleting substances and the intentional addition of mercury. Manufacturers must maintain an inspection system complying with SAE AS9003 or ISO 9001 tailored to SAE AS9003, and acceptance is based on zero non-conformances using sampling methods per MIL-STD-1916 or ASQ H1331. Critical technical requirements include mandatory DOD qualified Electrostatic Discharge and Electromagnetic Interference protective packaging per MIL-PRF-81705, with specific barrier materials from QPL-81705 manufacturers to prevent damage to leads and terminals. Marking must adhere to MIL-STD-129 with special marking code 39 for ESD sensitivity. Administratively, the contract requires CMMC Level 2 Self-Assessment, adherence to the Buy American Act and Berry Amendment, and the use of the Wide Area WorkFlow system for invoicing. Quotations are due by October 26, 2026, and must be submitted to the issuing office in Columbus, Ohio.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 15 hours ago

DEADLINE

in 2 days

AI Contract Overview

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This subcontract for the Department of Defense, specifically Navsup Weapon Systems Support Mech, involves the physical assembly of circuit cards for prime contractors. The scope of work includes utilizing Surface Mount Technology, through-hole soldering, and manual assembly processes employing pick-and-place machines, reflow ovens, and X-ray inspection to deliver completed and tested Circuit Card Assemblies. The contractor is responsible for ensuring all marking adheres to MIL-STD-129 and maintaining strict quality assurance throughout the assembly process. This opportunity falls under NAICS code 334418 and has a response deadline of October 5, 2026.

General Info

DoD subcontract for circuit card assembly and testing, deadline October 5, 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QYAF9.

The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

59--CIRCUIT CARD ASSEMB

AI Contract Breakdown

Uniform Contract Format

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs physical assembly of circuit cards for prime contractors on Department of Defense projects. Utilizes Surface Mount Technology (SMT), through-hole soldering, and manual assembly using pick-and-place machines, reflow ovens, and X-ray inspection. Ensures marking per MIL-STD-129 and quality assurance for the assembly. Delivers completed and tested Circuit Card Assemblies.

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