Sources Sought for Laser Structuring System

SPECIFICATIONS Laser Structuring System NB 687100-18-00958 I. PURPOSE: NIST is seeking any qualified sources to provide a laser structuring system that can meet the below technical specifications. If you are interested and can meet the specifications, request you send in your capabilities documentation to Angela Hitt, Contracting Officer at NIST. Email her your capabilities at contact@example.gov. No phone calls will be accepted for this acquisition. Your responses are due no later than March 16, 2018 at 2 PM (MST). II. BACKGROUND: The Boulder Microfabrication Facility (BMF), operated by the Microfabrication Group in the Quantum Electromagnetics Division. The BMF requires a laser structuring system for a wide range of applications including: microfabrication of patterned circuit boards for microwave circuits, dielectric resonators, waveguides, silicon and metal sheet structures. The system is required for a variety of new programs that are fundamental to NIST mission critical work. III. DELIVERABLES: One Laser Structuring System. IV. TECHNICAL SPECIFICATIONS: 1. The tool must be manufactured with components that are compatible with an International Organization for Standardization (ISO) Class 7 cleanroom environment as according to ISO 14644. 2. The tool processing area must be in an enclosure. 3. The tool must include an acoustic and/or safety cabinet featuring an integrated safety switch. 4. For safety reasons, the tool must be engineered such that during operation the system qualifies as a Laser Class 1 according to 21 Code of Federal Regulations (CFR) Part 1040 in the United States and International Electrotechnical Commission Standard IEC 60825. 5. The tool must be automated by control software. The software must also have the ability to: a. Import design files from common CAD formats including but not limited to: (1) Gerber (2) DXF b. Calculate the laser path for processing. c. Store tool settings associated for processing different materials. 6. The laser must be controlled by galvanometer scanners and focused with a theta lens. 7. The laser pulse frequency must be Q-Switch controlled. 8. The laser system must include a tripled 355 nm source. 9. The control electronics must be integrated with the tool and located in the same enclosure. 10. The tool must have greater than 8 mm of Z axis clearance. 11. The work table must have a movement resolution better than 500 nm 12. The tool must have a repetition accuracy better than +/- 4 microns. 13. The tool software must control the travel speed, pulse frequency, output power, number of repetitions and the focal height. 14. The laser beam width must be nominally 20 microns at the focal point. 15. The tool must be able to remove surface metallization using a hatch and delaminate process. 16. The tool must be able to remove the metal laminate without damaging or modifying the underlying printed circuit board substrate. 17. The tool must be able to structure, depanel and drill printed circuit boards to the following specifications: a. Structuring Speed: greater than 150 mm/s on 18 micron thick copper on FR4 b. Cutting Speed: greater than 150 mm/s through 0.5 mm FR4 c. Minimum line / space: less than 60 / 30 microns on laminated substrate (18 micron thick copper) 18. The tool must have internal lighting. 19. The tool must have a pilot laser for rough positioning of the material on the work surface. 20. The tool must have an integrated vacuum table with a replaceable air-permeable insert. 21. Tool must have an integrated camera system that can be used for automatic positioning for the following applications: a. Recognition of fiducial marks and/or hole and subsequent software adjustment of the data to account for any offset. b. Inspection of drill holes and cut lines. c. Reloading of substrates for re-work. 22. The tool must have a HEPA filter and deep chemical filter dust extraction system, that is variable speed and software controlled. 23. The tool must be powered by 110 VAC at 60 Hz. The tool must include a power cord, plug and replaceable fuses. 24. The laser must be internally cooled within the machine. 25. The contractor shall provide toll-free technical support over the phone during normal business hours. 26. The contractor shall provide onsite training after the tool is installed. V. DELIVERABLE SCHEDULE: 8 weeks ARO VI. INSPECTION AND ACCEPTANCE: The tool must be able to demonstrate the ability to perform according to the specifications. Final acceptance will be determined within 30 days of delivery.