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This Government Contract opportunity from Department Of Defense was posted on August 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Specialized Electronic Component Packaging and Labeling

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 483111
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Solicitation # N3220526R6134
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NAICS: 483111
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NAICS: 483111
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NAICS: 483111
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NAICS: 483111
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MIL-SPEC Packaging and Labeling Services
MARITIME SUPPLY CHAIN

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NAICS: 483111
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MIL-SPEC Packaging and Marking Services
ACTIVE DEVICES DIVISION

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2 days ago

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NAICS: 483111
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ACTIVE DEVICES DIVISION

POSTED

2 days ago

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NAICS: 483111
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AI Contract Overview

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This subcontract for the Department of Defense Active Devices Division involves specialized packaging and labeling of microcircuits for prime contractors. The scope of work requires packaging components according to MIL-PRF-81705 standards to ensure protection against electrostatic discharge and electromagnetic interference using anti-static cushioning and compliant shielding materials. Additionally, the contractor must apply lead-finish marking per IPC/JEDEC J-STD-609 and label hazardous material containers in accordance with 29 CFR 1910.1200 to ensure all items are shipment-ready. The project is categorized under NAICS code 483111 and will be performed in Columbus, Ohio. Interested parties must respond by September 10, 2026, following the posting date of August 30, 2026.

General Info

DoD subcontract for microcircuit packaging and labeling in Columbus, Ohio, due September 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

483111 - Deep Sea Freight TransportationView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-453E.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs specialized packaging for prime contractors on DLA Active Devices Division projects. Packages microcircuits per MIL-PRF-81705 for ESD and EMI protection using anti-static cushioning. Applies lead-finish marking per IPC/JEDEC J-STD-609 and labels hazardous material containers per 29 CFR 1910.1200. Utilizes MIL-PRF-81705 compliant shielding materials. Delivers packaged and labeled microcircuits ready for shipment.

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