This Government Contract opportunity from Department Of Defense was posted on July 22, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Specialized Packaging and Labeling Services for Military Electronics
Contract Overview
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AI Contract Overview
The contract requires the provision of ESD-protective packaging and MIL-STD-129 compliant labeling for military microcircuits prior to shipment, ensuring that sensitive electronic components are safeguarded against electrostatic discharge and properly identified for military logistics. All packaging must meet stringent technical standards to preserve component integrity during transport and storage, while labeling must adhere precisely to MIL-STD-129 specifications for barcodes, data elements, and format to enable seamless tracking within the Department of Defense supply chain. The work is intended for performance in Columbus, Ohio, with a submission deadline of August 3, 2026, and is categorized as a subcontract under NAICS code 326199 for other plastic product manufacturing. The solicitation is managed by the Active Devices Division of the Department of Defense through a DIBBS platform posting, and offers must be submitted in accordance with all technical, compliance, and documentation requirements outlined in the procurement notice.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-339T.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITA
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION
Same awarding agency
Earlier notices in this NAICS code
Posted before this notice, open and closed
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