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Supply of Computer Subassembly (NSN 7050-01-531-0532)

Active

Federal

Response Deadline11/16/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract involves the supply of one Computer Subassembly, identified by NSN 7050-01-531-0532, to support prime contractors fulfilling Department of Defense supply contracts. The hardware must be delivered to FPO 96629 within 20 days of the order. The contractor is required to adhere to strict technical and quality standards, specifically complying with the DLA Master List of Technical and Quality Requirements (RA001). Additionally, all items must be packaged in accordance with RP001 and MIL-STD-2073-1E. This procurement falls under NAICS code 334111.

General Info

Supply one Computer Subassembly (NSN 7050-01-531-0532) to FPO 96629 within 20 days.

Agency

Department Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

NAICS

334111 - Electronic Computer Manufacturing

Place of Performance

FPO, AP, 96629, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE8EN-27-T-0316.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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COMPUTER SUBASSEMBLY

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Timeline

PostedNov 3

subcontract

Response DeadlineNov 16

Submission deadline

Response Deadline

11/16/2026, 05:00:00 PM UTCin 13 days

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Organization & Contact Information

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AgencyDepartment Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies one Computer Subassembly for prime contractors delivering DLA supply contracts. Provides hardware identified by NSN 7050-01-531-0532. Packages items per RP001 and MIL-STD-2073-1E and complies with DLA Master List of Technical and Quality Requirements (RA001). Delivers the completed, packaged subassembly within 20 days.

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