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Supply of Linear Microcircuits

Active

Federal

Response Deadline09/28/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract with the Department of Defense Active Devices Division involves the manufacture or sourcing of 26 linear microcircuits under NSN 013271211. The contractor is responsible for ensuring all units meet specific technical standards, including unit package marking for component lead finish according to IPC/JEDEC J-STD-609 and shipment labeling as per MIL-STD-129. The project requires strict adherence to FAR 52.246-2 for destination inspection to ensure quality control upon delivery. Performance for this contract will take place in Columbus, Ohio, with the final deliverable consisting of 26 properly marked and packaged microcircuits.

General Info

Contract for 26 linear microcircuits for DoD, delivered to Columbus, Ohio.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-498G.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

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Timeline

PostedSep 15

subcontract

Response DeadlineSep 28

Submission deadline

Response Deadline

09/28/2026, 05:00:00 PM UTCin 13 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies linear microcircuits for prime contractors on Active Devices Division projects. Manufactures or sources 26 units of NSN 013271211, applying unit package marking for component lead finish per IPC/JEDEC J-STD-609 and shipment labeling per MIL-STD-129. Requires compliance with FAR 52.246-2 for destination inspection. Delivers 26 properly marked and packaged linear microcircuits.

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