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Supply of NSN 5905-01-207-6970

Active

Federal

Response Deadline09/25/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract through the Department of Defense Active Devices Division involves the supply of electronic components, specifically NSN 5905-01-207-6970, for prime contractors fulfilling DLA supply contracts. The selected provider must manufacture or source components that adhere to the DLA Master List of Technical and Quality Requirements and L31 Additive Manufacturing standards, utilizing appropriate semiconductor or additive manufacturing equipment. The contract requires the provider to maintain an active SAM registration and deliver the physical electronic components to Robins Air Force Base. Interested parties must submit their responses by September 25, 2026, under NAICS code 334413.

General Info

DoD subcontract for electronic components delivery to Robins AFB by September 25, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

ROBINS A F B, GA, 31098-1887, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-497B.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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RESISTOR, VARIABLE, N

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Timeline

PostedSep 14

subcontract

Response DeadlineSep 25

Submission deadline

Response Deadline

09/25/2026, 05:00:00 PM UTCin 10 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

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Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies electronic components for prime contractors delivering DLA supply contracts, specifically NSN 5905-01-207-6970. Manufactures or sources components meeting DLA Master List of Technical and Quality Requirements and L31 Additive Manufacturing standards. Utilizes semiconductor manufacturing or additive manufacturing equipment. Requires SAM registration. Delivers the physical electronic component.

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