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This Government Contract opportunity from Department Of Defense was posted on September 1, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Supply of Semiconductor Device Assembly (NSN 5961010108814)

Closed
Federal

Contract Overview

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This subcontract involves the supply of semiconductor device assemblies, specifically NSN 5961010108814, for prime contractors supporting Department of Defense supply contracts through the Active Devices Division. The provider is responsible for manufacturing or procuring two units, ensuring strict adherence to lead finish identification per IPC/JEDEC J-STD-609 and maintaining supply chain traceability in accordance with DLA Directive C03. All items must be packaged and marked according to MIL-STD-129 and MIL-DTL-19491 standards, with delivery terms set as FOB Origin. To be eligible, the supplier must be placed on the Qualified Suppliers List of Distributors or the Qualified Testing Suppliers List. The contract falls under NAICS code 334413 and specifies the place of performance in Sioux City, Iowa. The solicitation period opens on September 1, 2026, with a response deadline of September 14, 2026.

General Info

Supply two semiconductor device assemblies for DoD via Active Devices Division in Iowa.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

SIOUX CITY, IA, 51106-5165, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-456T.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE A

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies semiconductor device assemblies for prime contractors delivering DLA supply contracts. Manufactures or procures NSN 5961010108814, ensuring lead finish identification per IPC/JEDEC J-STD-609 and supply chain traceability per DLA Directive C03. Packages and marks items per MIL-STD-129 and MIL-DTL-19491. Requires placement on the Qualified Suppliers List of Distributors or Qualified Testing Suppliers List. Delivers two units FOB Origin.

More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION

Same awarding agency

NAICS: 334417
New
DIBBS
BACKSHELL, ELECTRICAL C
Solicitation # SPE7M5-26-T-528J
Solicitation SPE7M5-26-T-528J is a fixed-price request for quotations issued by the DLA Land and Maritime Active Devices Division for the procurement of 58 electrical connector backshells, also described as electrical shields. The required items are identified by NSN 5935012499140 and manufacturer part number SDH-25BFCS from Cinch Connectivity Solutions Inc. This is designated as a critical application item. Delivery is required within 168 days after order, with a need ship date of March 23, 2027, and an original required delivery date of November 19, 2027. Shipping is FOB Origin, with the destination for both parcel and freight being the DLA Distribution DDSP New Cumberland Facility in Pennsylvania. The contract mandates strict quality and technical compliance, requiring the manufacturer's inspection system to meet SAE AS9003 or ISO 9001 standards. Sampling must follow MIL-STD-1916, ASQ H1331 Table 1, or a comparable zero-based sampling plan, with acceptance requiring zero non-conformances. Packaging must adhere to MIL-STD-129 for marking and labeling, with specific requirements for hazardous materials per FED-STD-313 and TQ requirement IP025, or commercial packaging per ASTM D3951 for non-hazardous items. Administrative requirements include the use of the Wide Area WorkFlow system for invoicing and compliance with the Buy American Act and Berry Amendment.
Electronic Connector Manufacturing

POSTED

3 days ago

DEADLINE

in 2 days
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