Supply of TPT HB05 Precision Wire Bonder System

The contract seeks the procurement of a commercial off-the-shelf TPT HB05 Wire Bonder system designed to replicate exactly the performance, user interface, control software, and bonding parameters of the existing unit already in use at NIST. This system is critical for quantum device packaging and nanoscale metrology applications, where precision and consistency are paramount. The requirement emphasizes seamless integration with current workflows to ensure continuity in research and development activities without disruption or retraining. All technical specifications must align fully with the existing instrument to maintain standardized operations across the facility. The solicitation is issued as a subcontract under NAICS code 333242, with a response deadline of August 4, 2026, and a place of performance located in Gaithersburg, Maryland, at the NIST facility. The contract does not specify any set-aside provisions or organizational type restrictions, opening eligibility to any qualified vendor capable of delivering the exact match required. The system must be delivered and configured to operate immediately within NIST's established environment, ensuring that all software interfaces, control protocols, and bonding parameters are functionally indistinguishable from the current unit to preserve experimental integrity and data consistency.