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Supply of TPT HB05 Precision Wire Bonder System

Active

Federal

Response Deadline08/04/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department Of Commerce NistView Agency

NAICS

333242 - Semiconductor Machinery ManufacturingView NAICS

Place of Performance

Gaithersburg, MD, 20899, USA

Set-Aside

NONE

Documents

(0)

No documents available

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PostedJul 20

subcontract

Response DeadlineAug 4

Submission deadline

Response Deadline

08/04/2026, 04:00:00 PM UTCin 11 days

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Organization & Contact Information

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AgencyDepartment Of Commerce Nist

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Commerce Nist

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Procurement of a commercial off-the-shelf TPT HB05 Wire Bonder system matching NIST's existing unit in performance, user interface, control software, and bonding parameters for use in quantum device packaging and nanoscale metrology.

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