This Government Contract opportunity from Department Of Defense was posted on April 14, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Technical Data Package (TDP) Development and Documentation
Contract Overview
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AI Contract Overview
The contract involves the development and delivery of a comprehensive Technical Data Package (TDP) tailored to meet military standards. This package includes detailed schematics, Bills of Materials (BOMs), assembly drawings, test procedures, and compliance documentation essential for weapon systems support. The work is being subcontracted under NAICS code 541330, which covers engineering services. Issued by the Department of Defense through the Navsup Weapon Systems Support Mech office, the solicitation was posted on April 14, 2026, with a response deadline of May 8, 2026. Although specific location details and points of contact are not provided, the contract is clearly geared towards ensuring thorough documentation and stringent compliance catering to defense sector needs, supporting efficient assembly, testing, and maintenance of military equipment.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
This scope was carved out of N0010426QZA96.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Procurement of CIRCUIT CARD ASSEMB; NSN: 7HH 5998 015334496 VU
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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