ULTRASONIC INSTRUME

The contract solicitation SPE2DH-26-T-3953 calls for the procurement of a single unit of an ultrasonic endodontic instrument, specifically the Diamond Microsurgical KIS-5D, designed for use on the buccal roots of the mandibular left molar and the mesial buccal root of the maxillary right molar, with a 0.5mm diameter and 3.0mm cutting surface. The item is identified by NSN 6520-01-533-1594 and is classified under NAICS code 339114, indicating its alignment with medical and dental equipment manufacturing. Delivery is required to the destination in Kaiserslautern, Germany, or via APO AE 09227-0000, with a strict 84-day delivery timeline from the order date, and FOB Destination terms place full transportation responsibility on the contractor. The unit price listed for this item is up to $131.88, though multiple pricing entries appear in the solicitation without clear line-item alignment, leaving the final contract value indeterminate. The procurement is subject to comprehensive technical, packaging, and quality requirements, including compliance with MIL-STD-2073-1E for packaging and preservation, adherence to Medical Marking Standard No. 1 (MMS No. 1) for labeling, and incorporation of the DLA Master List of Technical and Quality Requirements. Packaging must ensure protection during transit via common carrier, and all items must be sealed in unit containers. The contract includes a full suite of FAR and DFARS clauses covering inspection at destination, contract type flexibility, small business representation, cybersecurity safeguards, trafficking in persons, employment eligibility, hazardous materials handling, and safeguarding of covered defense information per NIST SP 800-171 and 252.204-7012. Invoicing must be submitted via WAWF, and contractors are required to provide their UEI or CAGE code along with full representations regarding small business status, socioeconomic designation, and prohibited telecommunications equipment. All submissions must be made electronically through the DLA Internet Bid Board System by May 26, 2026, with no paper or physical submissions permitted.