Vacuum Reflow Furnace for Hermetic Sealing

The contract pertains to the supply and integration of a vacuum reflow furnace designed to achieve a vacuum level of no more than 100 milliTorr and to execute precisely controlled thermal cycles for the hermetic sealing of chip carriers. This equipment is critical for applications requiring high reliability and environmental integrity in electronic components, particularly in defense and aerospace contexts. The furnace must be fully integrated and operational upon delivery, with capabilities tailored to meet stringent thermal profiling requirements necessary for sealing sensitive microelectronic packages without compromising their structural or electrical performance. The procurement is issued as a subcontract under the Naval Research Laboratory, part of the Department of Defense, with a place of performance identified as ZIP code 20375. The solicitation was posted on July 23, 2026, and responses are due by August 7, 2026, at 7:00 PM. The NAICS code 333298 indicates the procurement falls under other industrial machinery manufacturing, reflecting the specialized nature of the equipment. There is no set-aside designation specified, and the contract is open to eligible subcontractors capable of delivering a system that meets the technical performance criteria for vacuum and thermal control. All submissions must demonstrate compliance with the stated operational parameters and readiness for immediate deployment in a secure, high-reliability environment.