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Wafer-Scale Meta-Optics Fabrication (Nanoimprint Lithography)

Active

SBIR / STTR

Response Deadline08/26/2026, 04:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Office of the Secretary of Defense is seeking a subcontract for the development of wafer-scale meta-optics fabrication. The project focuses on the high-throughput patterning of metasurfaces on infrared-transparent semiconductor wafers, utilizing scalable nanoimprint or roll-to-roll techniques to achieve sub-100nm resolution and high aspect ratios. This opportunity is a total small business set-aside under the SBIR/STTR mandate, restricted to companies with fewer than 500 employees. The solicitation was posted on August 5, 2026, with a response deadline of August 26, 2026, falling under NAICS code 334310.

General Info

OSD seeks small business subcontracts for wafer-scale meta-optics fabrication by August 26, 2026.

Agency

Department of Defense → Office of the Secretary of DefenseView Agency

NAICS

334310 - Audio and Video Equipment ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

SBA

Documents

This scope was carved out of OSW26TZ05-NV003.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

High Throughput Wafer Scale Manufacturing of Custom Achromatic Infrared Meta Optics

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Timeline

PostedAug 5

subcontract

Response DeadlineAug 26

Submission deadline

Response Deadline

08/26/2026, 04:00:00 AM UTCin 7 days

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Organization & Contact Information

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AgencyDepartment of Defense → Office of the Secretary of Defense

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department of Defense → Office of the Secretary of Defense

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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High-throughput patterning of metasurfaces on IR-transparent semiconductor wafers using scalable nanoimprint or roll-to-roll techniques with sub-100nm resolution and high aspect ratios.

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