Andrew Ganster

Andrew Ganster serves as the Technical Point of Contact at Naval Surface Warfare Center, Crane Division (N00164), where he provides critical technical oversight for acquisitions supporting advanced electronic, electro-optical, and ordnance systems essential to naval warfare. In this role, he collaborates closely with contracting professionals to define technical requirements, evaluate vendor proposals, and ensure compliance with military specifications for signal processing, electronic warfare, and radar detection platforms. His expertise ensures that procurement decisions align with operational needs across surface and expeditionary forces, with a focus on mission-critical hardware and integrated subsystems. Ganster maintains consistent technical partnerships with leading defense contractors including Lockheed Martin Corporation, Programs Management Analytics & Technologies Inc., and Integrity Defense Services Inc., who deliver sophisticated electronic systems and technical support services. He also engages with specialized manufacturers such as Black Hills Ammunition Inc. for ordnance-related components and McKenzie Construction & Site Development LLC for facility infrastructure supporting testing and assembly operations. His working relationships are characterized by long-term collaboration, rigorous technical validation, and a demand for proven performance in high-reliability environments. Ganster’s procurement portfolio reflects a 100% no set-aside preference, indicating a focus on full and open competition driven by technical complexity and national security requirements. While small business participation is not formally prioritized through socioeconomic set-asides, his team evaluates all vendors on technical merit, performance history, and ability to meet stringent military standards, ensuring mission readiness over socioeconomic categorization. His primary procurement focus is centered on NAICS 334412—Bare Printed Circuit Board Manufacturing—reflecting deep specialization in the design and production of high-density, ruggedized circuitry for defense electronics. He oversees the acquisition of custom bare PCBs, hybrid modules, and associated components integral to signal conditioning, EW suites, and sensor systems, demonstrating expertise in advanced manufacturing processes critical to modern naval platforms.