58--WAFER BONDER UPGRADE

NASA/GSFC has a requirement for SUSS wafer bonder Model SB6e, hardware and software upgrade for IT compatibility requiring Windows 7. NASA/GSFC intends to purchase the items from Microsemi SoC Corp pursuant to Far 13.106 for the acquisition of supplies or services determined to be reasonably available from one source. Suss Microtech Inc., is the only company that can provide the required proprietary hardware and software to communicate with the existing tool to be upgraded. The Government intends to acquire a commercial item using FAR Part 12. Interested organizations may E-MAIL their capabilities and qualifications to perform the effort in writing to contact@example.gov not later than 4:30 p.m. local time on Wednesday, September 16th, 2015. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications ARE NOT acceptable in response to this notice. All responsible sources may submit an offer which shall be considered by the agency. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/p ub_library/Omb.html .