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59--SEMICONDUCTOR DEVIC

Awarded
SPE7M526T9992Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract awarded under solicitation number SPE7M56T9992 is for semiconductor devices and is managed by the DLA Land and Maritime office within the Department of Defense. The award notice was posted on April 30, 2026, and the associated NAICS code is 334413, indicating the focus on semiconductor and related device manufacturing. The primary point of contact is Jacob Mokma, reachable at [email hidden] or by phone at [phone hidden], with the office located in Columbus, Ohio, 43218-3990. No specific place of performance is detailed, and there is no assigned type of set-aside for small businesses or other categories. The contract details are accessible through the SAM.gov workspace link provided for further inquiry.

General Info

Semiconductor contract awarded by DLA Land and Maritime, contact Jacob Mokma, Columbus, Ohio.

Contract Value

$67,927.35

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

OH, USA

Set-Aside

NONE

Award Issued Date

Documents

0

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Timeline

PhaseAwarded
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Awarded

Contract was awarded

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA Land And Maritime
Contacts1 person available
OfficeCOLUMBUS, OH, 43218-3990, USA
Office AddressCOLUMBUS, OH, 43218-3990, USA

Full Description

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Proposed procurement for NSN 5961011654001 SEMICONDUCTOR DEVIC: Line 0001 Qty 127 UI EA Deliver To: W1A8 DLA DISTRIBUTION By: 0093 DAYS ADO Approved sources are 29056 11436889-2; 31338 11436889-2; 66844 11436889-2; 81483 11436889-2. The solicitation is an RFQ and will be available at the link provided in this notice. Hard copies of this solicitation are not available. Specifications, plans, or drawings are not available. All responsible sources may submit a quote which, if timely received, shall be considered. Quotes must be submitted electronically.

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