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A -- Advance Technology Support Program III (ATSP3)

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ATSP3Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

The Defense Microelectronics Activity (DMEA) is preparing to acquire engineering services under the Advanced Technology Support Program III (ATSP3), building on the success of its previous ATSP contracts. The program aims to extend the operational life of weapon systems by addressing electronics support challenges such as reliability, maintainability, and sourcing issues through advanced microelectronics technologies. The contract encompasses a broad spectrum of activities including studies, analysis, design, coding, simulation, prototyping, integration, testing, and limited production of both hardware and software. Additionally, it involves developing procedures for utilizing available tools and resources, as well as strategies for selecting replacement alternatives and facilitating technical information exchange to ensure successful task completion. The upcoming contract will be awarded using a Source Selection process and will be structured as an indefinite delivery, indefinite quantity (IDIQ) contract with multiple awards. Interested parties are directed to the DMEA website, where draft requirements, acquisition schedules, and queries related to source list development are available. The solicitation process will follow a "Build RFP" approach, allowing the solicitation to evolve over time with active industry participation and feedback. In line with Department of Defense initiatives to reduce paper use, all communications concerning the acquisition will be conducted electronically.

General Info

DMEA seeks IDIQ multiple-award contract for advanced microelectronics engineering services under ATSP3.

Agency

N/A

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

Not specified

Set-Aside

NONE

Documents

No documents available

Documents will appear here when they are available.

AI Contract Breakdown

Uniform Contract Format

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Timeline

PostedJan 8

special-notice

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Organization & Contact Information

AgencyN/A

ContactsNo contacts available

OfficeN/A

Organization / Agency

N/A

Office AddressN/A

ContactsNo contact information available

Full Description

ADVANCED TECHNOLOGY SUPPORT PROGRAM III (ATSP3). The Defense Microelectronics Activity (DMEA) is planning to acquire engineering services for the ATSP3, which is a follow-on to the highly successful ATSP series of contracts. The purpose of this announcement is to provide notice of an upcoming Source Selection for the ATSP3 requirement and to publicize the DMEA web site where additional information is available. The Advanced Technology Support Program III (ATSP3) is a uniform technical and management approach that leverages advanced technologies to extend the life of weapons systems. Electronics support problems, such as, reliability, maintainability and diminishing manufacturing sources are solved through the development of insertions and applications of advanced microelectronics technologies. The requirement covers both hardware and software and includes studies, analysis, design, code, simulation, prototyping, integration, testing, and limited production. The requirement also includes the development of viable methods of procedures for using available tools and resources, strategies for resolution of replacement alternatives, and for technical interchange in support of task accomplishment. A Source Selection methodology will be utilized to make multiple awards for this indefinite delivery, indefinite quantity type contract. The DMEA web site is located at: http://www.dmea.osd.mil/atsp3ss where draft requirements documents, including an acquisition schedule and a source list development query are located. This site will utilize the - Build RFP approach where the solicitation will be assembled over time, with industry comments and suggestions encouraged. In support of the Department of Defense paperless initiatives, all communications regarding this acquisition will be electronic.

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