ACAN 25-58272 Automated Linear Multi-Module WaferTrack System

Advance Contract Award Notice (ACAN) ACAN 25-58272 Automated Linear Multi-Module Wafer Track System 1. Advance Contract Award Notice (ACAN) An ACAN is a public notice indicating to the supplier community that a department or agency intends to award a contract for goods, services or construction to a pre-identified supplier, thereby allowing other suppliers to signal their interest in bidding, by submitting a statement of capabilities. If no supplier submits a statement of capabilities that meets the requirements set out in the ACAN, on or before the closing date stated in the ACAN, the contracting officer may then proceed with the award to the pre-identified supplier. 2. Definition of the Requirement: The National Research Council Canada’s (NRC) has a requirement for the supply, delivery, installation, qualification, and user training for one (1) Automated Linear Multi-Module Wafer Track System (System). The highly specialized System will provide a fully integrated and automated process flow that replaces the existing manual workflow currently used for bisbenzocyclobutene (BCB) dielectric coating. The automated track must perform all coating, thermal processing (bake), and chilling steps within a single, compact, linear architecture that conforms to the CPFC’s strict cleanroom space limitations. . 3. Criteria for assessment of the Statement of Capabilities (Minimum Essential Requirements) Any interested supplier must demonstrate by way of a Statement of Capabilities that its System meets the following requirements: The System must: - utilize an automated linear track architecture comprising a send, bake, chill, coat, bake and receive steps/modules; - utilize a linear, single-track, architecture where the total cabinet footprint must not exceed 35.5in width and 82.5in length; - fit within the facility’s limited footprint constraints—utilizing a linear, single-track architecture that does not exceed 35.5 inches in width and 82.5 inches in length; - be capable of processing both 3-inch (75mm) and 4-inch (100mm) round semiconductor substrates. The transition between sizes must be managed via software recipes or minimal hardware adjustments; - include a 3-pin vacuum contact chill plate with a hard-anodized surface to stabilize substrates after baking; - be capable of handling at least two (2) of the following industry-standard cassette densities simultaneously: • 3/16-inch pitch (25 substrates), • 1/4-inch pitch (20 substrates), and • 3/8-inch pitch (12 substrates for thick or warped wafers). - utilize an automated substrate transport mechanism to move wafers between all process modules; - include a controller with GUI to allow the system configuration, monitoring, troubleshooting, and recipe storage; - include a precision syringe pump and controller specifically designed to dispense high-viscosity polymers like BCB without bubbles or clogging; - include a 3-pin vacuum contact chill plate with a hard-anodized surface to stabilize substrates after baking; - include a precision syringe pump and controller specifically designed to dispense high-viscosity polymers like BCB without bubbles or clogging; - have programmable exhaust flow controllers and digital vacuum switches to ensure safety and process repeatability; - include a minimum of three (3) 5-gallon solvent dispense canisters equipped with low-level sensors and stainless-steel fluid lines; - include a minimum of one (1) 5-gallon waste container with leak sensor and spill containment; - be equipped with an integrated filter fan unit mounted to the top of the enclosure; - accept 120VAC, 208V single phase, or 208V three phase power at 60Hz. The use of a vendor supplied transformer is acceptable. ¬The System indexers must support SEMI standard H configurations. The automated substrate transport mechanism must use digital vacuum sensing and have a repeatability of +/-0.1mm or better. The integrated bake modules must support a programmable temperature range from 50°C to at least 300°C. The Bake modules must feature 3-pin programmable proximity baking to ensure thermal uniformity and prevent substrate contamination. Plates must be made of cast aluminum with a hard-anodized surface for chemical resistance. The coater module must: - include a programmable pivoting arm capable of supporting at least three (3) independent dispense nozzles. - include an integrated wash system. This system must be software-programmable to perform self-cleaning cycles. The coater must: - be equipped with both top and bottom Edge Bead Removal (EBR) systems for both 3-inch and 4-inch substrates; - utilize a low-turbulence catch cup design to minimize solvent misting and re-deposition on the wafer surface during high-speed spins; - utilize a low-turbulence catch cup design to minimize solvent misting and re-deposition on the wafer surface during high-speed spins The coating module must include an integrated wash system. This system must be software-programmable to perform self-cleaning cycles. - Fluid lines and wiring must be constructed of Teflon (or equivalent fluoropolymer); - Cabinetry must be electropolished stainless steel for cleanroom compatibility; - The system’s primary control computer must utilize a RAID 1 configuration to ensure that in the event of a single drive failure, the system remains fully operational with no loss of process recipes, calibration data, or operating logs. The Contractor must: - include a spare coat bowl and a spare part kit comprising commonly replaced components; - demonstrate system reliability by testing the mechanical, electrical, pneumatic and peripheral equipment for a minimum of 60 hours prior to shipment; - demonstrate system reliability by passing a minimum of 1,000 wafers through the track prior to shipment. All electrical equipment supplied under the Contract must be certified or approved for use in accordance with the Canadian Electrical Code, Part 1, before delivery, by a certification organization accredited by the Standards Council of Canada, such as Underwriters Laboratories (UL). Refer to Recognized Canadian Electrical Product or Equipment Approval Marks | Standards Council of Canada - Conseil canadien des normes (scc.ca) for more details. The equipment must bear the certification label. Canada intends to retain ownership of any Foreground Intellectual Property (IP) arising from the proposed contract as the main purpose of the contract is to generate knowledge and information for public dissemination. 4. Applicability of the trade agreement(s) to the procurement This procurement is subject to the following trade agreements: • Canadian Free Trade Agreement (CFTA) • World Trade Organization - Agreement on Government Procurement (WTO-AGP) • Canada-European Union Comprehensive Economic and Trade Agreement (CETA) • Comprehensive and Progressive Agreement for Trans-Pacific Partnership (CPTPP) • Canada-Chile Free Trade Agreement (CCFTA) • Canada-Colombia Free Trade Agreement • Canada-Honduras Free Trade Agreement • Canada-Korea Free Trade Agreement • Canada-Panama Free Trade Agreement • Canada-Peru Free Trade Agreement (CPFTA) • Canada-United Kingdom Trade Continuity Agreement (Canada-UK TCA) • Canada-Ukraine Free Trade Agreement (CUFTA) 5. Justification for the Pre-Identified Supplier The proposed C&D Semiconductor’s P8000 Linear Track Wafer Processing System and its unique features, make it the only System that can satisfy the requirement. The System’s linear wafer transfer mechanism reduces particle contamination, simplifies maintenance, and allows for fast, direct wafer handoffs between modules. The System’s compact lab-friendly footprint does not exceed 35.5 inches in width and 82.5 inches in length. The System’s independent environmental control module, multi-wafer size re-configuration, integrated linear utilities, and open, customizable software make the P8000 the only System that meets NRC’s requirement. 6. Government Contracts Regulations (GCR) Exception(s) The following exception to the GCR is invoked for this procurement under: • Subsection 6(d) - only one firm is capable of performing the contract. 7. Exclusions and/or Limited Tendering Reasons The following exclusion(s) and/or limited tendering reasons are invoked under the: Canadian Free Trade Agreement (CFTA) – Article 513 (1) (b) (iii): due to an absence of competition for technical reasons; World Trade Organization - Agreement on Government Procurement (WTO-AGP) – Article XIII (b) (iii): due to an absence of competition for technical reasons; Canada-European Union Comprehensive Economic and Trade Agreement (CETA) – Article 19.12 (b) (iii): due to an absence of competition for technical reasons; Comprehensive and Progressive Agreement for Trans-Pacific Partnership (CPTPP) – Article 15.10 (2) (b) (iii): due to an absence of competition for technical reasons; Canada-Chile Free Trade Agreement (CCFTA) – Article Kbis-16 (2) (c): necessary to protect intellectual property; Canada-Colombia Free Trade Agreement – Article 1409 (1) (b) (iii): due to an absence of competition for technical reasons; Canada-Honduras Free Trade Agreement – Article 17.11 (2) (b) (iii): due to an absence of competition for technical reasons; Canada-Korea Free Trade Agreement – referencing the WTO Protocol Amending the GPA, Article XIII (1) (b) (iii): due to an absence of competition for technical reasons; Canada-Panama Free Trade Agreement – Article 16.10 (1) (b) (iii): because of the absence of competition for technical reasons; Canada-Peru Free Trade Agreement (CPFTA) –Article 1409 (1) (b) (iii): due to an absence of competition for technical reasons; Canada-United Kingdom Trade Continuity Agreement: refer to CETA as the provisions of CETA are incorporated by reference into and made part of this Agreement. (CETA) Article 19.12 (b) (iii); Canada-Ukraine Free Trade Agreement (CUFTA) – Limited Tendering Article 10.13 (b) (iii) due to an absence of competition for technical reasons. 8. Period of the proposed contract and delivery date The System must be delivered on or before March 31, 2026. 9. Cost estimate of the proposed contract The estimated value of the contract is $422,800.00 USD (applicable taxes are extra). 10. Name and address of the pre-identified supplier C&D Semiconductor Services 14 Old Indian Trail Milton, NY 12547 USA 11. Suppliers' right to submit a Statement of Capabilities Suppliers who consider themselves fully qualified and available to provide the goods and services described in the ACAN may submit a Statement of Capabilities in writing to the contact person identified in this notice on or before the closing date of this notice. The Statement of Capabilities must clearly demonstrate how the supplier meets the advertised requirements. 12. Closing date for a submission of a Statement of Capabilities The closing date and time for accepting Statements of Capabilities is: February 6th, 2026 at 2pm EST. 13. Inquiries and submission of Statement of Capabilities Inquiries and Submission of a Statement of Capabilities must be sent to: Katie Homuth | Senior Contracting Officer Procurement and Contracting Services | Finance and Procurement Services Branch National Research Council Canada | Government of Canada Katie.Homuth@nrc-cnrc.gc.ca | 343-549-4539