Advanced Chiplet Design & Architecture Development

The contract calls for the development of next-generation chiplet architectures tailored for critical Department of Defense applications in artificial intelligence and machine learning, radio frequency systems, and munitions technologies. This effort requires a detailed gap analysis of existing intellectual property blocks and interconnect solutions to identify technical deficiencies and opportunities for innovation, ensuring that chiplet designs meet the stringent performance, reliability, and security demands of defense systems. The work must also include long-term forecasting of workforce, manufacturing, and supply chain demands across the Defense Industrial Base to align development with future operational needs and sustainability goals. The project is structured as a subcontract with a NAICS code of 541715, indicating it falls under scientific research and development services. It was posted on July 8, 2026, with proposals due by July 23, 2026, under the oversight of the FA8002 Saf Aq office within the Department of Defense. While details such as place of performance, point of contact, and set-aside status are not provided, the emphasis on advanced semiconductor innovation for national defense applications underscores the sensitivity and strategic importance of this initiative, requiring advanced technical expertise and a clear understanding of DoD acquisition and industrial base dynamics.