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This Government Contract opportunity from Department Of Defense was posted on July 8, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Advanced Chiplet Design & Architecture Development

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 541715
New
Federal
Atomically Precise Molecules (APM)
Solicitation # DARPA-PS-26-141
The Atomically Precise Molecules (APM) program, solicitation DARPA-PS-26-141, is a 36-month initiative by the DARPA Multi X Office seeking innovative synthesis techniques for programmable precision polymers (PPPs) and nonlinear optical (NLO) materials. The program aims to develop scalable materials with strictly controlled monomer sequences and compositions, culminating in a prototype NLO material integrated into a government-provided electro-optic modulator capable of achieving greater than 1THz modulation. The effort is structured in two phases, with Phase I lasting 12 months and focusing on synthesis capabilities. Research limited to inorganic materials or incremental improvements to existing state-of-the-art practices is specifically excluded. Awards will be issued as Other Transaction for Prototype Agreements, with payments processed through the Wide Area Workflow system based on a schedule of milestones. Proposals are due by December 18, 2026, via the Broad Agency Announcement Tool and must include technical, management, and pricing volumes. Eligibility is restricted to U.S. organizations, and all performers must comply with CMMC Level 2 self-certification and NIST SP 800-171 standards for safeguarding Controlled Unclassified Information. Evaluation will be based on technical approach, relevance to the DARPA mission, budget realism, and the capability to transition the technology to military or commercial sectors.
Defense Advanced Research Projects Agcy

POSTED

about 22 hours ago

DEADLINE

in about 2 months
NAICS: 541715
New
Federal
Request for Proposal (RFP) - Resilient Missile Warning Tracking (RMWT) Low Earth Orbit (LEO) Ground Entry Points (GEPs)
Solicitation # FA240126R0003
The Space Development Agency is soliciting proposals under solicitation FA240126R0003 for the Resilient Missile Warning Tracking Low Earth Orbit Ground Entry Points effort. This acquisition is structured as an Indefinite Delivery Indefinite Quantity contract with a ceiling of 369 million dollars, covering the development, integration, test, operations, and maintenance of Tranche 3 Ground Entry Points at multiple globally dispersed locations. The scope of work encompasses civil engineering from detailed design through construction, the procurement and installation of communications shelters, antennas, optical terminals, and networking equipment, as well as the development of Ground Support Equipment and Auxiliary Development Units. The contract includes an ordering period from March 31, 2027, to September 30, 2031, with option periods extending through September 30, 2035. Award will be determined using a best value tradeoff process where technical, management, and past performance factors are combined and considered significantly more important than price. The technical evaluation focuses on the understanding of requirements, feasibility of approach, and scalability, while management is assessed based on project and schedule management, subcontractor oversight, and security handling. Proposals must be submitted in seven volumes via the DoD Secure Access File Exchange by 4:00 PM Eastern Time on November 23, 2026. Large business primes are required to meet a minimum quantitative requirement of 5 percent small business participation. The contract utilizes a mix of Firm Fixed Price for primary labor and materials and Cost Reimbursable arrangements for other direct costs and travel.
FA2401 Space Development Agency Sda

POSTED

about 22 hours ago

DEADLINE

in 26 days

AI Contract Overview

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The contract calls for the development of next-generation chiplet architectures tailored for critical Department of Defense applications in artificial intelligence and machine learning, radio frequency systems, and munitions technologies. This effort requires a detailed gap analysis of existing intellectual property blocks and interconnect solutions to identify technical deficiencies and opportunities for innovation, ensuring that chiplet designs meet the stringent performance, reliability, and security demands of defense systems. The work must also include long-term forecasting of workforce, manufacturing, and supply chain demands across the Defense Industrial Base to align development with future operational needs and sustainability goals. The project is structured as a subcontract with a NAICS code of 541715, indicating it falls under scientific research and development services. It was posted on July 8, 2026, with proposals due by July 23, 2026, under the oversight of the FA8002 Saf Aq office within the Department of Defense. While details such as place of performance, point of contact, and set-aside status are not provided, the emphasis on advanced semiconductor innovation for national defense applications underscores the sensitivity and strategic importance of this initiative, requiring advanced technical expertise and a clear understanding of DoD acquisition and industrial base dynamics.

General Info

Develop next-gen chiplets for DoD AI, RF, and munitions with gap analysis and workforce forecasting.

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

DC, USA

Set-Aside

NONE

Documents

This scope was carved out of SAFAQC.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CALL 1 – SECURE ENCLAVE CHIPLETS_Amendment 2

AI Contract Breakdown

Uniform Contract Format

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The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8002 Saf Aq
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Develop next-generation chiplet architectures for DoD applications in AI/ML, RF, and munitions, including gap analysis of IP blocks and interconnects and long-term demand forecasting across the Defense Industrial Base.

Earlier notices in this NAICS code

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