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Advanced Packaging and Heterogeneous Integration

Active

Federal

Response Deadline10/01/2029, 05:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract for the Department of Energy focuses on advanced packaging and heterogeneous integration of microelectronic components at Sandia National Laboratories. The scope of work involves the assembly and integration of complex technologies, including 3D stacking, chiplets, 2.5D packaging, and integrated photonic packages, with a specific emphasis on high-power modules for high voltage applications. The contractor is responsible for utilizing specialized 3D stacking equipment and chiplet interconnect technology to deliver fully packaged microelectronic modules. This effort supports prime contractors on critical Department of Energy projects, with the performance of work centered in the 87123 zip code area.

General Info

DOE subcontract for advanced microelectronic packaging and integration at Sandia National Laboratories.

Agency

Department Of EnergyView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

NM, 87123, USA

Set-Aside

NONE

Documents

This scope was carved out of 26_04.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies

AI Contract Breakdown

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Timeline

PostedMar 25

subcontract

Response DeadlineOct 1

Submission deadline

Response Deadline

10/01/2029, 05:59:00 AM UTCin about 3 years

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Organization & Contact Information

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AgencyDepartment Of Energy

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Energy

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Office AddressN/A

ContactsNo contact information available

Full Description

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Performs advanced assembly, packaging, and integration of microelectronic components for prime contractors on Department of Energy projects at Sandia National Laboratories. Implements heterogeneous integration, 3D packaging, chiplets, 3D stacking, 2.5D packaging, and integrated photonic packages, including high-power modules for high voltage. Uses 3D stacking equipment and chiplet interconnect technology. Delivers packaged microelectronic modules.

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