Air-Cooled Cryogenic Temperature Control System Design & Integration

The contract seeks the design, supply, and integration of an air-cooled cryogenic temperature control system capable of maintaining a wafer chuck at -60°C without inducing ice formation, specifically for use with the MPI TS2000-IFE probe station. The system must be engineered to operate reliably in a laboratory environment while meeting stringent thermal stability and contamination control requirements, ensuring precise temperature regulation for semiconductor testing applications. Compatibility with the existing probe station is mandatory, requiring seamless physical, electrical, and software integration without modification to the host equipment. The work is to be performed at the specified place of performance in Boulder, Colorado, with a response deadline of May 19, 2026, and the solicitation was published on May 4, 2026. This is a subcontract opportunity under NAICS code 333318, which pertains to other commercial and service machinery manufacturing. The contracting entity is the Department of Commerce, National Institute of Standards and Technology, indicating the project supports advanced metrology and semiconductor research initiatives. All proposals must demonstrate technical feasibility, robustness against environmental moisture, and adherence to performance specifications without reliance on liquid cryogens.