Amendment 1 to Automatic Wire Bonder
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This is a predicted recompete opportunity for the Department of Commerce NIST involving an automatic wire bonder, currently held by Hesse Mechatronics, Inc. with a contract value of 168,790 dollars. The current contract is expected to end on October 16, 2026, and is classified as likely to be competed under a firm fixed price structure. The procurement is designated as a total small business set-aside under NAICS code 339113. The technical requirements focus on the ability to wire bond 1 square centimeter chips into 256-pin double-tiered ceramic packages to streamline the current process. The required equipment must include an inspection scope and a mechanism to fix sample pieces to the stage. The project is based in Gaithersburg, Maryland, and is being managed by the National Institute of Standards and Technology.
General Info
Place of Performance
Gaithersburg, MD, 20899, USASet-Aside
Documents
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Timeline
Organization & Contact Information
Full Description
Current Contract: 1333ND26PNB030100 Incumbent: HESSE MECHATRONICS, INC Contract Value: $168,790 Potential End Date: 2026-10-16T00:00:00.000Z Competition: COMPETED UNDER SAP Pricing: FIRM FIXED PRICE Classification: recompete-likely (Confidence: medium - 65/100)
AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:
Vendor Question 1:
Can you let me know if the parts will be held on flat boats or manually placed on the workholder?
NIST Response:
The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.
Vendor Question 2:
Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?
NIST Response:
No
Vendor Question 3:
Application: What type of bonding applications do you plan to run with the new wire bonder?
NIST Response:
We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process
Vendor Question 4:
Bonding Tools: Are there specific bonding tools or configurations required for your applications?
NIST Response:
You will find this information in the Statement of Work.
Vendor Question 5:
Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?
NIST Response:
The tool should contain a scope for inspection and a way to fix the sample piece to the stage.
As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses
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