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Automated Optical Inspection & Test Program Development

Active
Federal

Contract Overview

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The contract requires the development of Automated Optical Inspection and in-circuit test programs to verify the quality and reliability of newly manufactured or repaired circuit card assemblies, leveraging existing surface mount technology infrastructure. The scope centers on creating robust test methodologies that ensure electrical functionality and visual integrity of PCBs, with all work to be performed at Tobyhanna, Pennsylvania, under the auspices of the Department of Defense through the W6QK Acc-Apg Cont Ct Tyad Ofc office. The project is categorized under NAICS code 541330 for engineering services and is designated as a subcontract opportunity with no specific set-aside provisions. Bidders must submit proposals by August 10, 2026, and are expected to possess expertise in test program development, AOI software configuration, and integration with SMT production lines. The work must align with military-grade standards for durability and performance, though specific technical requirements or compliance frameworks are not detailed in the public-facing data. All deliverables will support the defense supply chain by enabling consistent quality assurance for electronic components critical to defense systems.

General Info

Develop AOI and in-circuit test programs for defense PCBs at Tobyhanna, PA, under DoD contract by August 10, 2026.

Agency

Department Of Defense → W6QK Acc-Apg Cont Ct Tyad OfcView Agency

NAICS

541330 - Engineering ServicesView NAICS

Place of Performance

Tobyhanna, PA, 18466, USA

Set-Aside

NONE

Documents

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QK Acc-Apg Cont Ct Tyad Ofc
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → W6QK Acc-Apg Cont Ct Tyad Ofc
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Office AddressN/A
ContactsNo contact information available

Full Description

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Develop AOI and in-circuit test programs to ensure quality and reliability of newly manufactured or repaired circuit card assemblies using existing SMT infrastructure.

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in over 2 years

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