Automated Wafer Defect Inspection and Surface Characterization System (SDIP)

The contract involves the supply and integration of an advanced laser-based automated system designed for the non-destructive inspection and classification of sub-micron surface defects on wafers produced through Metal-Organic Chemical Vapor Deposition (MOCVD) processes. This system aims to enhance the detection and characterization of wafer surface flaws with high precision, ensuring improved quality control in semiconductor manufacturing. Issued by the National Research Council of Canada, part of the Government of Canada, the subcontract focuses on incorporating cutting-edge technology to automate defect inspection, thereby increasing efficiency and accuracy. The solicitation was posted in mid-June 2026, with responses due by the end of that month. The work is to be performed within Canada and falls under the NAICS code 333318, which pertains to manufacturing machinery and equipment. This initiative supports advancements in semiconductor inspection technology critical for modern electronic device fabrication.