This Combined Synopsis/Solicitation opportunity from Department Of Commerce was posted on March 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Amendment 1 to Automatic Wire Bonder
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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The contract involves the procurement of an Automatic Wire Bonder and is issued by the Department of Commerce, specifically under the National Institute of Standards and Technology (NIST) office in Gaithersburg, Maryland. It is a combined synopsis solicitation incorporating a statement of work along with applicable provisions and clauses. The solicitation number for this opportunity is 1333ND26QNB030043, with the solicitation posted on March 6, 2026, and responses due by March 20, 2026, at 4:00 PM. This procurement is set aside entirely for small businesses under the SBA’s Total Small Business Set-Aside program, as outlined in FAR 19.5, and falls under the NAICS code 333242, which relates to semiconductor machinery manufacturing. Performance of the contract will take place in Gaithersburg, Maryland. The agency's point of contact for this procurement includes Elizabeth Timberlake as the primary contact and Tracy Retterer as the secondary contact, both accessible via email for inquiries. Interested parties can access further details and submit their proposals through the provided online workspace link on the federal contracting portal. This acquisition aims to equip the agency with specialized equipment to support its technical and research operations in the field of precision wire bonding.
General Info
Contract Value
$168,790Place of Performance
Gaithersburg, MD, 20899, USASet-Aside
Awardee
HESSE MECHATRONICS, INCAward Issued Date
Timeline
Submission Closed
Organization & Contact Information
Full Description
AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:
Vendor Question 1:
Can you let me know if the parts will be held on flat boats or manually placed on the workholder?
NIST Response:
The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.
Vendor Question 2:
Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?
NIST Response:
No
Vendor Question 3:
Application: What type of bonding applications do you plan to run with the new wire bonder?
NIST Response:
We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process
Vendor Question 4:
Bonding Tools: Are there specific bonding tools or configurations required for your applications?
NIST Response:
You will find this information in the Statement of Work.
Vendor Question 5:
Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?
NIST Response:
The tool should contain a scope for inspection and a way to fix the sample piece to the stage.
As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses
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