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This Government Contract opportunity from Department Of Defense was posted on August 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Bare Board Fabrication (F-16 CCA)

Closed
Federal

Contract Overview

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This subcontract involves the fabrication of raw, unpopulated printed circuit boards for electronics projects associated with USAF F-16 aircraft. The scope of work includes layering, etching, drilling, plating, and surface finishing of PCB substrates using high-precision equipment and aerospace-standard materials such as polyimide or high-Tg FR-4. All production must strictly adhere to Technical Data Packages, GE Aviation Systems or USU Space Dynamics Laboratory drawings, and IPC-A-600 or MIL-PRF specifications. The project is managed by the Department of Defense under agency FA8212 Afsc Olh Pzaba, with the place of performance located at Hill Air Force Base. The solicitation was posted on August 27, 2026, with a response deadline of September 8, 2026. Classified under NAICS code 334412, the primary objective is the delivery of high-quality bare circuit boards to prime contractors.

General Info

Fabrication of aerospace-standard bare PCBs for USAF F-16 aircraft at Hill Air Force Base.

Agency

Department Of Defense → FA8212 Afsc Olh PzabaView Agency

NAICS

334412 - Bare Printed Circuit Board ManufacturingView NAICS

Place of Performance

Hill Air Force Base, UT, 84056, USA

Set-Aside

NONE

Documents

This scope was carved out of FD20202600237.

The full solicitation package (6 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

F-16 Circuit Card Assembly- 5-Year IDIQ

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8212 Afsc Olh Pzaba
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → FA8212 Afsc Olh Pzaba
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates raw, unpopulated printed circuit boards for prime contractors on USAF F-16 aircraft electronics projects. Performs layering, etching, drilling, plating, and surface finishing of the PCB substrate per Technical Data Packages (TDP) and GE Aviation Systems or USU Space Dynamics Laboratory drawings. Uses high-precision fabrication equipment and aerospace-standard materials such as high-Tg FR-4 or polyimide. Adheres to IPC-A-600 or MIL-PRF specifications. Delivers unpopulated bare circuit boards.

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Miguel
Hillary
Keith Deutsch
Christine

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