This Government Contract opportunity from Department Of Defense was posted on August 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Bare Board Fabrication (F-16 CCA)

Closed

Federal

Submission Closed09/08/2026, 09:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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Specialized PCB Fabrication (NSN 5998016434816)This subcontract involves the fabrication of five Printed Circuit Boards for the DLA Weapons Support Active Devices Division under the Department of Defense. The manufacturer must produce the boards in strict accordance with the technical drawings and material specifications for NSN 5998016434816, with a specific requirement that no mercury be intentionally added during the process. To qualify, the contractor must possess fabrication equipment capable of meeting military-grade specifications and maintain a CMMC Level 2 Self-Assessment. The project is categorized under NAICS code 334412, with performance taking place in New Cumberland, Pennsylvania. The response deadline for this requirement is November 9, 2026.

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Supply of Circuit Card Assemblies (NSN 5998-01-736-8074)This subcontract through the DLA Weapons Support Maritime Supply Chain requires the delivery of 100 Circuit Card Assemblies under NSN 5998-01-736-8074. The contractor is responsible for manufacturing or sourcing these units according to Harting part number 09 14 012 3101 or Federal Equipment Co part number 7A20071. Performance will take place in New Cumberland, Pennsylvania, with a response deadline of November 9, 2026. Strict adherence to quality and regulatory standards is mandatory, including the DLA Master List, MIL-STD-2073-1E, and MIL-STD-129 for packaging. Additionally, the contractor must comply with NAVSEA 5100-003D regarding mercury containment, NIST SP 800-171 for cybersecurity, and the Buy American Act. The final deliverable consists of 100 fully packaged units meeting all specified technical and safety requirements.

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DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 21 hours ago

DEADLINE

in 12 days

AI Contract Overview

This subcontract involves the fabrication of raw, unpopulated printed circuit boards for electronics projects associated with USAF F-16 aircraft. The scope of work includes layering, etching, drilling, plating, and surface finishing of PCB substrates using high-precision equipment and aerospace-standard materials such as polyimide or high-Tg FR-4. All production must strictly adhere to Technical Data Packages, GE Aviation Systems or USU Space Dynamics Laboratory drawings, and IPC-A-600 or MIL-PRF specifications. The project is managed by the Department of Defense under agency FA8212 Afsc Olh Pzaba, with the place of performance located at Hill Air Force Base. The solicitation was posted on August 27, 2026, with a response deadline of September 8, 2026. Classified under NAICS code 334412, the primary objective is the delivery of high-quality bare circuit boards to prime contractors.

General Info

Fabrication of aerospace-standard bare PCBs for USAF F-16 aircraft at Hill Air Force Base.

Agency

Department Of Defense → FA8212 Afsc Olh Pzaba

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

Hill Air Force Base, UT, 84056, USA

Set-Aside

NONE

Documents

This scope was carved out of FD20202600237.

The full solicitation package (6 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

F-16 Circuit Card Assembly- 5-Year IDIQ

AI Contract Breakdown

Uniform Contract Format

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The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedAug 27

subcontract

Response DeadlineSep 8

Deadline has passed

Submission Closed

09/08/2026, 09:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → FA8212 Afsc Olh Pzaba

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → FA8212 Afsc Olh Pzaba

Office AddressN/A

ContactsNo contact information available

Full Description

Fabricates raw, unpopulated printed circuit boards for prime contractors on USAF F-16 aircraft electronics projects. Performs layering, etching, drilling, plating, and surface finishing of the PCB substrate per Technical Data Packages (TDP) and GE Aviation Systems or USU Space Dynamics Laboratory drawings. Uses high-precision fabrication equipment and aerospace-standard materials such as high-Tg FR-4 or polyimide. Adheres to IPC-A-600 or MIL-PRF specifications. Delivers unpopulated bare circuit boards.