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Bare PCB Fabrication

Active

Federal

Response Deadline10/19/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract involves the fabrication of raw, unpopulated printed circuit boards for prime contractors supporting NAVSUP Weapon Systems Support projects under the Department of Defense. The scope of work includes etching, drilling, plating, solder mask application, and silkscreening, all performed according to provided Gerber files and design specifications to deliver bare printed circuit boards. The opportunity is categorized under NAICS code 334413 and was posted on September 15, 2026. Interested parties must submit their responses by the deadline of October 19, 2026, at 8:30 PM.

General Info

Subcontract for fabricating bare printed circuit boards for NAVSUP projects by October 19.

Agency

Department Of Defense → Navsup Weapon Systems Support MechView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QQA90.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

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Timeline

PostedSep 15

subcontract

Response DeadlineOct 19

Submission deadline

Response Deadline

10/19/2026, 08:30:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Navsup Weapon Systems Support Mech

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Fabricates raw, unpopulated printed circuit boards for prime contractors on NAVSUP Weapon Systems Support projects. Performs etching, drilling, plating, solder mask application, and silkscreening based on Gerber files and design specifications. Delivers bare printed circuit boards.

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