This Subcontract opportunity from Department Of Defense was posted on September 15, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Bare PCB Fabrication
Contract Overview
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AI Contract Overview
This subcontract involves the fabrication of raw, unpopulated printed circuit boards for prime contractors supporting NAVSUP Weapon Systems Support projects under the Department of Defense. The scope of work includes etching, drilling, plating, solder mask application, and silkscreening, all performed according to provided Gerber files and design specifications to deliver bare printed circuit boards. The opportunity is categorized under NAICS code 334413 and was posted on September 15, 2026. Interested parties must submit their responses by the deadline of October 19, 2026, at 8:30 PM.
General Info
Place of Performance
PASet-Aside
Documents
This scope was carved out of N0010426QQA90.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → Navsup Weapon Systems Support Mech
Same awarding agency
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