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This Government Contract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Bare PCB Fabrication

Closed
Federal

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This subcontract involves the fabrication of 2,000 unpopulated bare printed circuit boards for prime contractors supporting the DLA Weapons Support Maritime Supply Chain. The scope of work encompasses the full manufacturing process, including substrate fabrication, etching, drilling, plating of circuit paths, and the application of silkscreen and solder mask. All production must utilize high-precision machinery and military-grade materials to ensure strict adherence to the DLA Master List of Technical and Quality Requirements RA001. The project is managed under the Department of Defense and is categorized under NAICS code 334413. Performance of the contract will take place in New Cumberland, Pennsylvania. Interested parties should note the response deadline of October 23, 2026, for this specific procurement effort.

General Info

Fabricate 2,000 military-grade bare printed circuit boards for DLA by October 23, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-27-T-0879.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates raw, unpopulated printed circuit boards for prime contractors on DLA Weapons Support Maritime Supply Chain projects. Performs substrate manufacturing, etching, drilling, plating of circuit paths, and application of solder mask and silkscreen. Uses high-precision PCB fabrication machinery and military-grade materials. Must meet DLA Master List of Technical and Quality Requirements (RA001). Delivers 2,000 unpopulated bare circuit boards.

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