This Government Contract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Photo Semiconductor Device Manufacturing
Contract Overview
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AI Contract Overview
This subcontract, issued by the DLA Weapons Support Active Devices Division, involves the manufacture of 8,000 photo semiconductor devices, specifically part number 594R177H02. The scope of work encompasses the fabrication of semiconductor wafers and photo-sensitive elements, as well as assembly, packaging, and lead finish marking in accordance with IPC/JEDEC J-STD-609 standards. The project requires full supply chain traceability and will be performed at Hill AFB. As a total small business set-aside under NAICS code 334413, the contract mandates strict adherence to security and regulatory standards. Qualified contractors must possess CMMC Level 2 and JCP certifications and maintain full compliance with ITAR and EAR regulations. The solicitation was posted on October 12, 2026, with a response deadline of October 23, 2026.
General Info
Place of Performance
HILL AFB, UT, 84056-5734, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-0818.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
SEMICONDUCTOR DEVICE, P
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION
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