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This Government Contract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Photo Semiconductor Device Manufacturing

Closed
Federal

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This subcontract, issued by the DLA Weapons Support Active Devices Division, involves the manufacture of 8,000 photo semiconductor devices, specifically part number 594R177H02. The scope of work encompasses the fabrication of semiconductor wafers and photo-sensitive elements, as well as assembly, packaging, and lead finish marking in accordance with IPC/JEDEC J-STD-609 standards. The project requires full supply chain traceability and will be performed at Hill AFB. As a total small business set-aside under NAICS code 334413, the contract mandates strict adherence to security and regulatory standards. Qualified contractors must possess CMMC Level 2 and JCP certifications and maintain full compliance with ITAR and EAR regulations. The solicitation was posted on October 12, 2026, with a response deadline of October 23, 2026.

General Info

DLA subcontract for 8,000 photo semiconductor devices at Hill AFB for small businesses.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

HILL AFB, UT, 84056-5734, USA

Set-Aside

SBA

Documents

This scope was carved out of SPE7M5-27-T-0818.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE, P

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures photo semiconductor devices (NSN 5961-01-723-2243) for prime contractors on DLA Weapons Support contracts. Fabricates semiconductor wafers and photo-sensitive elements, performs assembly and packaging, and ensures lead finish marking per IPC/JEDEC J-STD-609. Requires CMMC Level 2, JCP certification, and ITAR/EAR compliance. Delivers 8,000 units of P/N 594R177H02 with full supply chain traceability.

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Miguel
Hillary
Keith Deutsch
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