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SEMICONDUCTOR DEVICE, D

Active
SPE7M5-27-T-1630Federal

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Solicitation SPE7M5-27-T-1630 is a small business set-aside request for quotations issued by the DLA Weapons Support Active Devices Division for the procurement of two semiconductor device diodes, identified by NSN 5961-01-026-2577. The contract requires delivery to Tobyhanna, Pennsylvania, within five days of order, with shipping conducted via the fastest traceable means. Inspection and acceptance are both set at the destination. The contractor must adhere to strict quality and technical standards, including the DLA Master List of Technical and Quality Requirements and the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for Federal Supply Class 5961. Packaging and marking must comply with MIL-STD-129, MIL-STD-2073-1E, and MIL-DTL-19491, with specific component lead finish markings required per IPC/JEDEC J-STD-609. Additionally, the contractor must maintain supply chain traceability documentation and utilize the Wide Area Workflow system for electronic invoicing and payment requests. The solicitation incorporates various DFARS and FAR clauses regarding cybersecurity, the Buy American Act, and the prohibition of covered defense telecommunications equipment.

General Info

Small business solicitation for two semiconductor device diodes delivered to Tobyhanna, Pennsylvania.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

ASARS 1C BAY 6, TOBYHANNA, PA, 18466-5050, USA

Set-Aside

NONE

Documents

1

RFQ SPE7M5-27-T-1630

PDF, High priority: read this first18 pages · rfq
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Timeline

PhaseSolicitation
Posted

Solicitation

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION
Contacts1 person available
OfficeUSA

Full Description

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SEMICONDUCTOR DEVICE,DIODE
SEMICONDUCTOR DEVICE,DIODE
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
SPE7M5-27-T-1630
SECTION B
NORTHROP GRUMMAN SUPPORT SERVICES CORP 48306 P/N 649A856H01
SEMTECH CORPUS CHRISTI, S.A. DE C.V. SH879 P/N SA4767
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018873077 0001 EA 2.000
NSN/MATERIAL:5961010262577
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:ZZ
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:C
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
SPE7M5-27-T-1630
SECTION B
PR: 7018873077 PRLI: 0001 CONT’D
BULK BREAK POINT:
W90CGG
W0ML USA DEP TOBYHANNA
SQUIRE STREET
ASRS RECEIVING BLDG 1 BAY 6
TOBYHANNA PA 18466-0000
US
SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
W25G1V
W0ML USA DEP TOBYHANNA
SQUIRE STREET
ASARS 1C BAY 6
TOBYHANNA PA 18466-5050
US
MARKFOR
W25G1V
W0ML USA DEP TOBYHANNA
SQUIRE STREET
ASARS 1C BAY 6
TOBYHANNA PA 18466-5050
US
M/F: (TCN) W25G1V629500EF
RDD: 305
PROJ: TP 1
SUPP ADD: W25G1V SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A0A DIST: ADV: 2L FC: VK
Need Ship Date:00/00/0000 Original Required Delivery Date:10/27/2026
SPE7M5-27-T-1630 NSN/Part Number: 5961-01-026-2577 Quantity: 2 EA Purchase Request: 7018873077QTY: 2 Delivery: 5 days ADO

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