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Bare Printed Circuit Board Fabrication

Active
Federal

Contract Overview

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This subcontract involves the fabrication of bare, unpopulated printed circuit boards for prime contractors supporting DLA Mechanicsburg projects. The selected provider must manufacture the boards according to the technical specifications of design ROF61205/4, utilizing specific etching, drilling, plating, and solder mask processes. To be eligible, the contractor must maintain OCM/OEM or QPL/QML approved source status and ensure full compliance with the Buy American and Balance of Payments Program. All delivered products must include comprehensive material traceability in accordance with DLAD Procurement Note C03. This requirement falls under NAICS code 334413 and is managed by the Department of Defense through the SPRMM1 DLA Mechanicsburg agency. The response deadline for this opportunity is November 27, 2026.

General Info

Fabrication of bare printed circuit boards for DLA Mechanicsburg by November 27, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QKA49.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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CIRCUIT CARD ASSEMB

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies bare, unpopulated printed circuit boards for prime contractors on DLA Mechanicsburg projects. Fabricates boards to technical specifications of design ROF61205/4 using etching, drilling, plating, and solder mask processes. Requires OCM/OEM or QPL/QML approved source status and compliance with Buy American and Balance of Payments Program. Delivers bare printed circuit boards with full material traceability per DLAD Procurement Note C03.

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