This Solicitation opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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SEMICONDUCTOR DEVICE, P

Closed

SPE7M5-27-T-0818Federal

Submission Closed10/23/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Defense Logistics Agency

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Supply of Push Switches (NSN 5930-01-062-4904)This subcontract involves the supply of push switches identified by NSN 5930-01-062-4904 for prime contractors supporting the Department of Defense DLA Weapons Support Maritime Supply Chain. The selected source or manufacturer must provide one unit of the specified switch, ensuring compliance with RP001 packaging requirements and strict mercury-free material restrictions. The use of approved additive manufacturing processes is permitted to meet the technical specifications. The opportunity is categorized under NAICS code 334413 and was posted on October 28, 2026, with a response deadline of November 9, 2026. All deliverables must be packaged according to DLA specifications to ensure successful integration into the maritime supply chain.

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CONSTRUCTION & EQUIPMENT MANU & CON

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Supply of Fixed Wire Wound Noninductive ResistorsThis subcontract involves the supply of fixed, wire wound, noninductive resistors to prime contractors for DLA and Army electronic component contracts. The scope of work requires the manufacture or procurement of one unit of NSN 5905-01-106-7481, specifically Part RE80N38R3, in strict accordance with MIL-PRF-18546/2C(4) specifications. All deliverables must adhere to MIL-STD-2073-1E for packaging and MIL-STD-129 and IPC/JEDEC J-STD-609 for marking requirements. Managed by the Department of Defense under the DLA Weapons Support Active Devices Division, the contract is categorized under NAICS code 334413. The delivery terms are established as FOB Origin, with the place of performance located at Fort Bliss, Texas. The response deadline for this requirement is November 9, 2026.

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Supply of Fixed Film Resistor Networks (NSN 5905-01-351-3639)This subcontract involves the supply of two fixed film resistor networks, identified by NSN 5905013513639, for prime contractors supporting the DLA Weapons Support Active Devices Division. The performance of this contract takes place in Fort Bliss, Texas, and requires strict adherence to RP001 packaging, RA001 quality requirements, and MIL-STD-129 marking standards. To be eligible, providers must maintain quality systems certified under SAE AS9003 or ISO 9001. Additionally, the contract mandates cybersecurity compliance in accordance with DFARS 252.204-7012 and NIST SP 800-171. The solicitation was posted on October 28, 2026, with a response deadline of November 9, 2026.

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Supply of Electronic Plug-in Sockets (NSN 5935-01-237-3880)This subcontract involves the supply of 150 electronic plug-in sockets, specifically TE Connectivity part 8-1437531-4 under NSN 5935-01-237-3880, to support prime contractors for the DLA Weapons Support Active Devices Division. The scope of work includes the manufacture or procurement of these components, with performance taking place in New Cumberland. Strict quality and logistical standards are required for this engagement. The provider must ensure packaging adheres to RP001 and marking follows MIL-STD-129. Furthermore, the contract mandates sampling compliance with MIL-STD-1916 or ASQ H1331, while requiring zero-nonconformance in accordance with MIL-STD-105/ASQ Z1.4.

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DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 2 hours ago

DEADLINE

in 12 days

AI Contract Overview

This solicitation, issued by the DLA Weapons Support Active Devices Division, is for the procurement of 8,000 units of a photo semiconductor device, identified by NSN 5961-01-723-2243. The requirement is a total small business set-aside under NAICS code 334413. Delivery is required within 143 days, with a specified delivery date of March 9, 2027, to the DLA Distribution Depot Hill at Hill AFB, Utah. Inspection and acceptance will occur at the destination. The contract imposes stringent quality and security requirements, including CMMC Level 2 certification and compliance with NIST SP 800-171. Technical data is subject to ITAR or EAR export controls, and contractors must maintain supply chain traceability documentation. Packaging and marking must adhere to MIL-STD-129, RP001, and IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the Buy American and Balance of Payments Program applies to all quotes above the micro-purchase threshold. Payment will be processed electronically through the Wide Area WorkFlow system.

General Info

DLA small business set-aside for 8,000 photo semiconductor devices delivered by March 2027.

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

7537 WARDLEIGH RD, HILL AFB, UT, 84056-5734, USA

Set-Aside

SBA

Documents

RFQ SPE7M5-27-T-0818

rfq

High

AI Contract Breakdown

Uniform Contract Format

Timeline

PhaseClosed

PostedOct 12

Solicitation

Response DeadlineOct 23

Deadline has passed

Submission Closed

10/23/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Contacts1 person available

OfficeUSA

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressUSA

Contacts

Margaret Smith

contact@example.gov

+1 (555) 000-0000

Full Description

SEMICONDUCTOR DEVICE,PHOTO
SEMICONDUCTOR DEVICE:
RD005: Cybersecurity Maturity Model Certification (CMMC) Level 2 Certified Third-Party Assessment Organization (C3PAO) RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS (IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
SPE7M5-27-T-0818
SECTION B
MICROCIRCUITS
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD002, COVERED DEFENSE INFORMATION APPLIES
RQ032: EXPORT CONTROL OF TECHNICAL DATA
This item has technical data some or all of which is subject to export-control of either the International Traffic in Arms regulations (ITAR) or the Export Administration Regulations (EAR), and cannot be exported without prior authorization from either the Department of State or the Department of Commerce. Export includes disclosure of technical data to foreign persons and nationals whether located in the United States or abroad. This requirement applies equally to foreign national employees and U.S. companies and their foreign subsidiaries. DFARS 252.225-7048 is applicable to this data.
The Defense Logistics Agency (DLA) limits distribution of export-control technical data to DLA contractors that have an approved US/Canada Joint Certification Program (JCP) certification, have completed the Introduction to Proper Handling of DOD Export-Controlled Technical Data Training and the DLA Export-Controlled Technical Data Questionnaire (both are available at the web address given below), and have been approved by the DLA controlling authority to access the export-controlled data. NSN/Part Number: 5961-01-723-2243 Quantity: 8 EA Purchase Request: 7018673934QTY: 8 Delivery: 143 days ADO