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Bare Printed Circuit Board Fabrication

Open

Federal

Response Deadline12/07/2026, 03:30:00 PM EST

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for Bare Printed Circuit Board Fabrication supports prime contractors on DLA Mechanicsburg projects under the Department of Defense. The scope of work involves the fabrication of raw, unpopulated printed circuit boards utilizing high-precision etching and plating in strict accordance with TDP technical specifications. To ensure quality and compliance, the provider must adhere to DLATERMM11 approved supplier standards and provide full traceability to raw material sources, including certifications for mercury-free substrates. The project falls under NAICS code 334413 and is managed by SPRMM1 DLA Mechanicsburg. Interested parties should note the response deadline of December 7, 2026. The primary objective of the contract is the timely delivery of bare PCBs to facilitate final assembly for the agency.

General Info

Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QKA72.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

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Timeline

PostedNov 5

subcontract

Response DeadlineDec 7

Submission deadline

Response Deadline

12/07/2026, 03:30:00 PM ESTin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies bare, unpopulated printed circuit boards for prime contractors on DLA Mechanicsburg projects. Fabricates raw boards based on TDP technical specifications using high-precision etching and plating. Provides material certifications for mercury-free substrates and full traceability to raw material sources. Adheres to DLATERMM11 approved supplier standards. Delivers bare PCBs to support final assembly.

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